MPI TS300-SE Probe System

The MPI TS300-ShielDEnvironment™ (TS300-SE) is designed to ensure advanced EMI/RFI/light-tight shielding, ultra-low noise, low leakage measurement capabilities on 300 mm wafer in a temperature range from -60 to +300°C.

It’s incorporated with vibration isolation table at optimal height to make the daily operation very convenient.

MPI-AST-V20-001TS300-SE  Fact Sheet

TMPI-AST-V20-001S300-SE  Data Sheet

Features & Benefits

TS300-SE Probe System Platen

ShielDEnvironment™

MPI ShielDEnvironment™ is a high performance local environmental chamber providing excellent EMI- and light-tight shielded test environment for ultra-low noise, low capacitance measurements.

ShielDCap™

A fully configurable part of the MPI ShielDEnvironment™ which allows up to  4-port RF or up to 8-ports DC/Kelvin or a combination of those configurations. 

Easy to reconfigure with convenient shielding that is MPI ShielDCap™ – a lot of little things which make the…

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Air-Bearing Stage

The TS300-SE has a unique stage concept combining MPI air-bearing stage design, with simple one handed puck control, provides incredibly convenient operation for fast XY navigation and quick wafer loading with the accurate and fine positioning capability in addition over the entire travel range. Please check the unique Z chuck control in addition.

TS300-SE-Probe-System-Unique-platen-liftshaded

Unique Platen Lift with
Probe Hover Control™

The repeatable (1 µm) platen lift design has three discrete positions for contact, separation (300 µm), and loading (3 mm).  The lift includes a safety lock rotation utility which prevents accidental platform descent. These features offer unparalleled functionality and are standard offerings for…

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Unique Chuck Z Control

TS300-SE incorporates in addition to the air bearing XY stage – 5 mm Z chuck adjustment in µm resolution for fine and accurate contact / over-travel control or probe cards drop tip correction.

A 1 mm scale indicator provides easy feedback to the…

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Various Chuck Options

The TS300-SE is available with various chuck options to meet different budgets and application requirements.

Together MPI and ERS designed the new 300 mm thermal chuck PRIME™ technology family, offering unsurpassed thermal flexibility and the largest variety of thermal…

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Thermal Control Integration

The wafer loading door is  locked at any temperature below 15°C – this unique feature makes the TS300-SE the safest manual probe station in the market.

Furthermore, the thermal chuck can be operated via the fully integrated touchscreen display, ergonomically mounted in a convenient location on the prober for fast adjustment and immediate feedback.

ERS Patented AC3 Cooling Technology Incorporated

These chucks incorporate the patented AC3 cooling technology and self-management system to purge the MPI ShielDEnvironment™ using recycled cooling air, thus drastically reducing air consumption 30% to 50% as compared to other systems on the market.

TS300-SE Various optic options

Various Optic Options

MPI Optics are available with a choice between iMAG® M, or a single tube MPI SuperZoom™ SZ10, the MegaZoom™ MZ12 with up to 12x optical zoom and more than 42 mm working distance or EeyZoom™  EZ10 – the 10x optical zoom optic with ergonomic 20x eyepieces, 90 mm working distance and down to 2 µm optical resolving power.

Unique Upgrade Path

The modular design of the TS300-SE modular creates a unique upgrade path. All TS300-SE probing accessories, such as thermal chucks, microscope and positioners, can be upgraded or reconfigured to variety of application requirements covering tool lifespan for increasingly low cost of ownership.

The MPI TS300-SE probe systems with ShielDEnvironment™ provides maximum EMI shielding and allows for low noise device on-wafer measurements for wide verity of applications such as Device Characterization and ModelingRF/MicrowaveWafer Level ReliabilityFailure AnalysisDesign Validation, and High Power.