MPI TS3000-SE – with ShielDEnvironment™
The TS3000-SE is the consequent further development of the TS3000 probe system equipped with MPI ShielDEnvironment™ for ultra-low noise, extremely accurate and highly reliable DC/CV, 1/f, RTS and RF measurements, addressing primarily the needs of the Device Characterization , Wafer Level Reliability and RF & mmW applications.
The exclusive, actively cooled probe platen design provides maximal stability over the wide temperature range from -60° to 300°C and is making the TS3000-SE probe system an excellent choice for testing devices under different thermal conditions.
Features & Benefits
MPI ShielDEnvironment™ is a high performance local environmental chamber providing excellent EMI- and light-tight shielded test environment for ultra-low noise, low capacitance measurements.
A fully configurable part of the MPI ShielDEnvironment™ which allows up to 4-port RF or up to 8-ports DC/Kelvin or a combination of those configurations.
Easy to reconfigure with convenient shielding that is MPI ShielDCap™ – a lot of little things which make the difference in simplifying day by day operations.
Easy Wafer Loading
The dual front door access and the unique chuck design allows easy loading / unloading procedure for 150, 200, 300 mm wafers, wafer fragments or small down to 4×4 mm ICs.
AUX chucks are both located in front where can be loaded / unloaded very conveniently. No roll-out stage allows for a simple method of automation for RF calibration and probe card cleaning.
Integrated Hardware Control Panel
The intelligent hardware control panel is completely integrated into the probe system and is designed based on decades of experience and customer interactions to provide faster, safer and convenient system control and test operation. The keyboard and mouse are strategically located to control the software if necessary and will also control the Windows® based instrumentation.
Thermal Chuck Integration
Due to smart chiller integration, the TS3000 series provide optimized footprint for saving the valuable space in the Lab.
Together MPI and ERS designed the New 300 mm Thermal Chuck AirCool® PRIME Technology family, offering unsurpassed thermal flexibility with reduced soaking time by 60%, and the largest variety of thermal ranges on market.
Reduced transition time, improved electrical performance, easier testing under inert-gas atmosphere, and field upgradability are additional values of the AirCool® PRIME thermal chuck systems.
The thermal systems can be operated by using the fully integrated touchscreen display, placed at convenient location in front of the operator for fast operation and immediate feedback.
ERS Patented AC3 Cooling Technology Incorporated
These chucks incorporate the patented AC3 cooling technology and self-management system to purge the MPI ShielDEnvironment™ using recycled cooling air, thus drastically reducing air consumption 30% to 50% as compared to other systems on the market.
Safety Test Management™ (STM) System
Unique STM system prevents opening of the doors during testing – your measurement results are safe. Accidental opening of any system door during a negative chuck temperature is not possible on any event. Furthermore an intelligent dew point control routine avoids acumination during cold testing. The system automatically monitors the flow of CDA or Nitrogen. If the flow is interrupt or insufficient the STM™ turns the chuck automatically into a safe mode – heat the chuck as fast as possible to above dew point. MPI STM™ is the feature that makes measurements with TS3000-SE safer, more reliable and convenient by automatically maintaining a safe test environment.
The optional instrument shelf reduces cable lengths and increases measurement dynamic and directivity.
Software Suite SENTIO®
MPI automated engineering probe systems are controlled by a unique and revolutionary, multi-touch operation SENTIO® Software Suite – simple and intuitive operation saves significant training time, the Scroll, Zoom, Move commands mimic modern smart mobile devices and allows everyone to become an expert in just minutes. Switching between the active application and the rest of the APPs is just matter of a simple finger sweep.