Probe Stations

150 mm Probe Stations

Wafer Prober

150mm Probe Stations

150mm Manual Probe Systems

200mm Probe Stations

150 mm Wafer Prober

Wafer Prober Manufacturer

Wafer Prober

200mm Wafer Prober Machine

Wafer Probing Station

150mm Manual Probe Station

MPI TS150, TS200 & TS300


MPI TS150, TS200 & TS300 probe stations are rich on exciting features, making the daily operation easy, intuitive, and convenient by ensuring highly accurate measurements.

Features & Benefits

   Air-Bearing Stage

The MPI unique air-bearing stage design, with simple single-handed puck control, provides unsurpassed convenience of operation for fast XY navigation and quick wafer loading without compromising accurate and fine positioning capability with the additional fine and accurate 25×25 mm XY-Theta micrometer movement.

MPI TS150, TS200, TS300 - The Unique Air Bearing Stage



Unique Platen Lift
with Probe Hover Control™

Measurement accuracy depends on the contact quality first! The highly repeatable (1µm) platen lift design with three discrete positions for contact, separation (300µm), and loading (3mm) with a safety lock utility are all examples of unparalleled functionality incorporated into MPI manual probe systems. These features prevent unexpected probe or wafer damage while providing intuitive control and accurate contact positioning. This capability is especially critical in both high frequency and high power applications in order to achieve the most accurate measurement results.

For TS200 and TS300, additional Probe Hover Control™ comes with hover heights (50, 100 or 150 µm) for easy and convenient probe to pad alignment.

Height Adjustment Scale

The probe platen has 25 mm of fine height adjustment required to support various applications. The unique 1mm accurate scale gives direct feedback about the current position.

MPI TS150, TS200, TS300 - Platen Height Adjustment Scale

Compact and Rigid Platen Design

The compact and rigid platen design accommodates up to ten DC or four RF MicroPositioners for various application requirements.

MPI TS150, TS200, TS300 - Compact Platen

Various Chuck Options

The manual systems are available with various chuck options to meet different budgets and application requirements. Chuck options include MPI’s coaxial or triaxial Chucks or various ERS thermal chucks to support temperature measurement up to 300 °C – as example for seamless integration of the thermal touch controller for quick and convenient access and operation.

MPI TS150, TS200, TS300 - Integrated Thermal Chuck Controller Panel

Auxiliary Chucks

The RF chucks include two auxiliary chucks built in ceramic material for accurate RF calibration.

MPI Ceramic Auxiliary Chucks

Various Optic and Movement Choices

A wide range of Optics is available with a choice between stereo for all common DC/CV applications or single tube high magnification microscopes for RF or load-pull configurations.

MPI Microscope Movement

Optic Tilting

90 degree tilting as a standard feature or even pneumatically driven, linear Z lift offers very convenient set-up and easy probe tips replacement.


Vibratrion Isolation Platform

All manual systems includes vibration absorbing base to achieve stable and reliable long-term probe to pad contact which ensures reliable measurement results. Vibration isolation platform or table are optional available where the laboratory environment requires extensive vibration protection.

MPI TS150 - Vibration Isolation Platform

Dark Box

The available Dark Box options provides an EMI-shielded and light-tight test environment for ultra-low noise DC measurements.

MPI Dark Box

MPI TS150, TS200 & TS300 Probe Systems

are open, easy to use and cost effective manual probe systems designed for precision analysis of substrates and wafers up to 150, 200 and 300mm. These systems address a wide variety of applications such as Failure AnalysiDesign Validation/IC Engineering, Wafer Level ReliabilityMEMSHigh Power and Device Characterization and Modeling.



Sr. Field Service/Repair Engineer (2 openings)

Job Duties:
Responsible for repair of very high pin count (>30,000 pins) MEM's, vertical and cantilever probe cards (VPC and CPC). Replace PCB electrical components such as: Capacitors, resistors, special MUX IC. Adjust VPC space transformer flatness between MLO substrate and PCB by interposer connection. Evaluate customer feedback on probe card issue and take full card inspection to find the root cause. Provide technical support to customer’s new probe card verification on wafer sort and debug to identify setup issues, wafer product issues or program issues. Conduct training on new probe card and new technology application, including on-line clean and off-line maintenance. Contribute to probe card technical improvement to HQ production line. 30% domestic travel required (travel within US to customers’ sites for field service and repair support)

Job Requirements:
5 yrs. field service support and repair of high pin count (>30,000 pins) vertical probe card and cantilever probe card.

Send resume with Job # 202108  to