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Laser Cutter | Laser Cutter | Probe Station | Silicon Wafer Cutting

Probe Station | Silicon Wafer Cutting | Silicon Wafer Cutting | Silicon Wafer Dicing

MPI Laser Cutter System LCS-635

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The unique MPI Laser Cutter System LCS-635 is designed for accurate and reliable Failure Analysis and Design Validation applications. Variable configurations based on 1064 nm, 532 nm, 355 nm or 266 nm wavelengths provides the capability to remove several semiconductor materials and metals selectively, see below the table.

Features & Benefits

High Beam Quality – Low Energy Consumption

The MPI Laser Cutter System is based on compact Diode Pump Solid State Laser, providing high beam quality, even at 266 nm, with enhanced pulse-to-pulse stability, and these by the unsurpassed low energy consumption.

Long Lifetime – Low Maintenance

The LCS-635 has more than 150x times longer lifetime as other conventional available laser systems on the market, and the passive, conductive laser head cooling, which eliminates the need for water, are making the system very reliable and reducing significantly the maintenance costs.

Intuitive Operation

Designing the SMART Controller with intuitive, touch-screen graphical user interface, four free-defined function buttons for fast, direct access, the six user cutting recipes, are making the daily operation of the Laser Cutter System very convenient and easy.

Intuitive Operation

Wavelength – Application Matrix

1064 nm
532 nm
355 / 266 nm
LCD Materials
ITO
Chromium
Color Filter
(Red / Green)
ITO
Chromium
Color Filter
(Blue / Green)
Color Filter
(Blue / Green)
Semiconductor Materials
N/A
Silicon Dioxide
Nitride Polyimide (big cuts)
SOG Poly-silicon
Nitride
Polyimide
Metals
Gold
Aluminum
Tungsten
Gold
Aluminum
Tungsten
Gold
Aluminum

      Scroll Right  >>

Wavelength – Application Matrix

1064 nm
532 nm
355 / 266 nm
LCD Materials
ITO
Chromium
Color Filter
(Red / Green)
ITO
Chromium
Color Filter
(Blue / Green)
Color Filter
(Blue / Green)
Semiconductor Materials
N/A
Silicon Dioxide
Nitride Polyimide (big cuts)
SOG Poly-silicon
Nitride
Polyimide
Metals
Gold
Aluminum
Tungsten
Gold
Aluminum
Tungsten
Gold
Aluminum

MPI Optics – Application Matrix

Microscope*1064 nm532 nm325 nm266 nm
FS70LYesYesYesNot Recommended
FS70L4YesYesYesYes
PSM1000YesYesNot RecommendedNot Recommended
VIS-200YesYesYesNot Recommended

* Other laser cutter compatible microscopes, on requests

MPI Optics – Application Matrix

      Scroll Right  >>

Microscope*1064 nm532 nm325 nm266 nm
FS70LYesYesYesNot Recommended
FS70L4YesYesYesYes
PSM1000YesYesNot RecommendedNot Recommended
VIS-200YesYesYesNot Recommended

* Other laser cutter compatible microscopes, on requests

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Sr. Field Service/Repair Engineer (2 openings)

Job Duties:
Responsible for repair of very high pin count (>30,000 pins) MEM's, vertical and cantilever probe cards (VPC and CPC). Replace PCB electrical components such as: Capacitors, resistors, special MUX IC. Adjust VPC space transformer flatness between MLO substrate and PCB by interposer connection. Evaluate customer feedback on probe card issue and take full card inspection to find the root cause. Provide technical support to customer’s new probe card verification on wafer sort and debug to identify setup issues, wafer product issues or program issues. Conduct training on new probe card and new technology application, including on-line clean and off-line maintenance. Contribute to probe card technical improvement to HQ production line. 30% domestic travel required (travel within US to customers’ sites for field service and repair support)

Job Requirements:
5 yrs. field service support and repair of high pin count (>30,000 pins) vertical probe card and cantilever probe card.

Send resume with Job # 202108  to CareerswithMPIAmerica@mpi-corporation.com