Device Characterization
High Power
RF-mmW
Design Validation
Failure Analysis
Wafer Level Reliability
Silicon Photonics
MEMS Test
Signal Integrity

TS2000-HP – Advanced High Power Solution

MPI’s automated TS2000-HP provides reliable on-wafer high power device measurement over wide-temperature range and measurement capability up to 3 kV (triax) / 10 kV (coax) and 600 A (pulsed). Advanced ShielDEnvironment™ offers low-noise and shielded test environment.

It incorporates MPI advanced technologies, such as  VCE™ ,  mDrive™  and/or  PHC™  optional or as an upgrade in the field.

TS2000-HP Fact Sheet

TS2000-HP Data Sheet

Characterizing Semiconductor Devices at Wafer Level
Video Copyright© Compound Semiconductor Applications (CSA) Catapult

Features & Benefits

Safety

 

Interlocked enabled safety light curtain to protect user from accidental high voltage shock by shutting down the instrument through interlock system.

The system has rear doors, protected by interlock as well in order to provide easy and convenient initial measurement set-up.

ShielDEnvironment™

 

MPI ShielDEnvironment™ is a high performance local environmental chamber providing excellent EMI- and light-tight shielded test environment for ultra-low noise, low capacitance measurements.

To prevent arcing between chuck and platen, TS2000-HP platen is specially designed with MPI advanced ArcShield™.

High Voltage, High Current and Ultra High Power Probes

 

MPI High Power probing solutions include the dedicated high current probes which use MPI propriety multi-contact tips for reduced contact resistance. MPl’s high voltage probes are capable of low leakage current measurements during high voltage tests up to 3 kV triaxial or 5 kV & 10 kV coaxial set-ups and up to 600 A.

MPI’s high-power probe card suspending arcing up to 10 kV and offering unique testing possibilities up to 150°C as well.

Optional Anti-Arcing LiquidTray™

 

Specially designed anti-arcing LiquidTray™ can be used for arcing suppressing by simply place on the high power chuck surface. Wafers can be safely placed inside the tray to submerge in the liquid for arcing free high voltage test.

Hot/Cold Wafer Swaps at Set Temperatures

 

The automated single wafer loader and the safety test management provide a unique capability to load/unload wafers at any chuck temperatures. Cooling down or heating up to ambient is not required anymore to load or unload a wafer. This saves major down time and increases the overall MPI Test Systems efficiency significantly. Necessary settings are protected by a convenient supervisor log-in procedure.

MPI TS2000-HP shares the same standard features, such as, thermal chuck integration, Safety Test Management™, automated single wafer loader, vibration isolation, and integrated prober control of the TS2000-SE system.

 

Feel the Difference

Software Suite SENTIO®

 

MPI automated engineering probe systems are controlled by a unique and revolutionary, multi-touch operation SENTIO® Software Suite – simple and intuitive operation saves significant training time, the Scroll, Zoom, Move commands mimic modern smart mobile devices and allows everyone to become an expert in just minutes. Switching between the active application and the rest of the APPs is just matter of a simple finger sweep.

For RF applications, there is no need to switch to another software platform – the MPI RF calibration software program QAlibria® is fully integrated with SENTIO® – for ease of use by following a single operational concept methodology.