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Wafer Probe Card | High Frequency Probing   |  LCD Driver Probe Card |  Vertical Driver Probe Card |  Parametric Probe Card  |  Logic Probe Card |  Cantilever Probe Card  

Probe Cards | Cantilever Probe Cards  | Probe Card Manufacturer | Cantilever Probe Cards |  Parametric Probe Card  | Semiconductor Probe Cards | Vertical Probe Card

Probe Card Test
Advanced Cobra Probe Card

Cantilever Probe Cards

Advanced Probe Cards

MPI Probe Card
MPI substrate and needle in-house fabrication ability

Continuous Technology Innovation

In-house Fabrication Facilities

Probe with Precision, Probe with MPI

PCB Technologies

Various PCB Layout Platforms

Multi-Layer PCB Design and Outsourcing

Precise Power and Signal Integrity Control

Probe Card PCB Test Technology
MPI Probe Card
Probe Card Fine Pitch Substrates

Substrate Technologies

Fan-Out Design for Fine Pitch Substrate

Patented Multi-DUT Substrate Design

Precise Power and Signal Integrity Control

MPI Probe Card
Probe Card Needle Technology

Complete Needle Technologies

Numerous High Quality Needle Technologies

High Pin Count, Low Contact Resistance, High CCC

MPI Probe Card
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LCD Driver Probe Card
Advanced Cobra Probe Card

Cantilever Probe Cards

Cantilever Probe Cards

Advanced Probe Cards

Advanced Probe Cards

PC201-1114-FFB81C
MPI substrate and needle in-house fabrication ability

Continuously Technology Innovation

In-house Fabrication Facilities

Probe with Precision, Probe with MPI

PCB Technologies

PCB Technologies

Various PCB Layout Platforms

Various PCB Layout Platforms

Multi-Layer PCB Design and Outsourcing

Multi-Layer PCB Design and Outsourcing

Precise Power and Signal Integrity Control

Precise Power and Signal Integrity Control

Semi Auto Micro LED Wafer Chip Prober
PC201-1114-FFB81C
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Substrate Technologies

Substrate Technologies

Fan-Out Design for Fine Pitch Substrate

Fan-Out Design for Fine Pitch Substrate

Patented Multi-DUT Substrate Design

Patented Multi-DUT Substrate Design

Precise Power and Signal Integrity Control

Precise Power and Signal Integrity Control

PC201-1114-FFB81C
Temperature-Forcing-System.fw_-2.png

Complete Needle Technologies

Complete Needle Technologies

Numerous High Quality Needle Technologies

Numerous High Quality Needle Technologies

High Pin Count, Low Contact Resistance, High CCC

High Pin Count, Low Contact Resistance, High CCC

PC201-1114-FFB81C
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Sr. Field Service/Repair Engineer (2 openings)

Job Duties:
Responsible for repair of very high pin count (>30,000 pins) MEM's, vertical and cantilever probe cards (VPC and CPC). Replace PCB electrical components such as: Capacitors, resistors, special MUX IC. Adjust VPC space transformer flatness between MLO substrate and PCB by interposer connection. Evaluate customer feedback on probe card issue and take full card inspection to find the root cause. Provide technical support to customer’s new probe card verification on wafer sort and debug to identify setup issues, wafer product issues or program issues. Conduct training on new probe card and new technology application, including on-line clean and off-line maintenance. Contribute to probe card technical improvement to HQ production line. 30% domestic travel required (travel within US to customers’ sites for field service and repair support)

Job Requirements:
5 yrs. field service support and repair of high pin count (>30,000 pins) vertical probe card and cantilever probe card.

Send resume with Job # 202108  to CareerswithMPIAmerica@mpi-corporation.com