Cantilever Probe Card
Advanced Probe Card
Continuous Technology Innovation
In-house Fabrication Facilities
Probe with Precision, Probe with MPI
PCB Technologies
Various PCB Layout Platforms
Multi-Layer PCB Design and Outsourcing
Precise Power and Signal Integrity Control
Substrate Technologies
Fan-Out Design for Fine Pitch Substrate
Patented Multi-DUT Substrate Design
Precise Power and Signal Integrity Control
Complete Needle Technologies
Numerous High Quality Needle Technologies
High Pin Count, Low Contact Resistance, High CCC
