Wafer Level Reliability

Wafer Level Reliability Testing

Wafer Reliability Probing

WLR Probing

Automated Probe Systems

High Temperature Wafer Level Reliability Testing

Wafer Level Reliability (WLR)

 Wafer Level Reliability | WLR probing

MPI Definition

Reliability is defined as the ability of a device to conform to its electrical specifications over a specified period of time under specified conditions at a specified confidence level. Once an integrated circuit (IC) has been designed and the first silicon comes out, Wafer Level Reliability (WLR) tests are performed to accelerate new IC designs and processes verification by assessing the reliability characteristics portion of the technology process. Examples:

  • Device Reliability: HCI, NBTI, PBTI…
  • Gate Oxide Integrity: TDDB, V-Ramp. HV-GOI…
  • Metal Interconnects: EM, ILD TDDB…

Major Requirements

The major challenge for WLR probing is to meet the contradictory requirements of the typical measure-stress-measure testing : high throughput, high flexibility, long-term measurements and sometimes at extreme temperatures.

MPI Solutions

MPI 300 °C AirCool® PRIME thermal chucks provide excellent flatness over entire temperature range and therefore provide deliver unparalleled performance for multi-site testing. Faster transition time of a chuck is a desirable factor in short term reliability tests at multiple temperatures to enhance the productivity.

On the other hand, reliability of the thermal system which consists of chuck, controller and the chiller, the embedded active probe platen cooling and the ability of the probe systems to assure stable contact over time are essential for long term WLR testing and minimization of the overall cost of test.

MPI integration of Celadon Systems high performance probe cards inside MPI Automated Probe Systems like TS2000-SE or TS3000-SE, makes the high density, multi-site, high temperature wafer level reliability testing easy and versatile.

MPI’s WaferWallet™ extends the TS3500-SE automation significantly without compromising measurement capability. It is designed with five individual trays for manual, ergonomic loading of 150, 200, or 300 mm “WLR” wafers for fully-automated tests.

error:

Sr. Field Service/Repair Engineer (2 openings)

Job Duties:
Responsible for repair of very high pin count (>30,000 pins) MEM's, vertical and cantilever probe cards (VPC and CPC). Replace PCB electrical components such as: Capacitors, resistors, special MUX IC. Adjust VPC space transformer flatness between MLO substrate and PCB by interposer connection. Evaluate customer feedback on probe card issue and take full card inspection to find the root cause. Provide technical support to customer’s new probe card verification on wafer sort and debug to identify setup issues, wafer product issues or program issues. Conduct training on new probe card and new technology application, including on-line clean and off-line maintenance. Contribute to probe card technical improvement to HQ production line. 30% domestic travel required (travel within US to customers’ sites for field service and repair support)

Job Requirements:
5 yrs. field service support and repair of high pin count (>30,000 pins) vertical probe card and cantilever probe card.

Send resume with Job # 202108  to CareerswithMPIAmerica@mpi-corporation.com