Design Validation and IC Engineering
IC design validation is critical to the success of today’s semiconductor manufacturing process.
In addition to electronic design automation (EDA) design verification tools, built-in-self-test (BIST) and design-for-test (DFT) methods, IC manufacturers are using a variety of methods to validate first silicon examples. This includes testing with engineering probe systems by using variety of instrumentation, automated test equipment (ATE) and dedicated engineering validation systems.
When doing measurements for IC engineering and design validation, engineers are challenged by the need for system configuration changes of test instrumentation such as DC and RF power sources and meters, oscilloscopes, and/or VNAs. Compounding the issue is measurement over temperature, high-impedance, frequency ranges and driving the IC with high pin-count probe cards. Cable interface to ATE is very common too.
The flexible design of MPI Engineering Probe Systems supports DC, triaxial and RF Chucks from 50 to 300 mm sizes with wide temperature ranges, entry-level and high-end DC and RF MicroPositioners, single-tube microscopes and Optic options with wide working distances, provide the ideal solution for any measurement need and budget capabilities.
Dual TITAN™ probes with GSGSG and GSSG is the ideal choice for the measurement mmW differential ICs. MPI also offers broadband active probes with replaceable probe tips and high input impedance for precise oscilloscope measurements.