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TS2500 Series – Fully Automatic Probe Systems for Production Test

TS2500 Series – Fully Automatic Probe Systems for Production Test

MPI TS2500-RF - 200 mm Fully Automated Probe System

MPI’s 200 mm fully automatic probe system series is specifically developed to address Radio Frequency (RF) or High Power device testing at the production level. The system is designed for 24/7 production reliability and compatible with all MPI system accessories.

Features & Benefits

TS2500-RF - RF Chuck with Two Auxiliary Chucks

Thin Wafer Handling

MPI ambient or ERS AirCool® thermal chucks support wide-range of temperature from 20°C to 300°C.

The unique design of TS2500 RF chucks and wafer lift pins can safely handle wafers with thickness down to 50 micrometers and thus enable testing of challenging thin III-Vs compounds wafers. The RF chucks include two auxiliary chucks constructed entirely with special ceramic material for accurate RF calibration. The auxiliary chucks may also serve to hold probe cleaning materials.

The  HP chucks are manufactured with low contact resistance and gold plated chuck tops. The chucks are fully integrated assemblies and are capable of holding wafers as thin as 70 µm. Users can configured high power chucks to support Taiko wafer types.

TS150 TS200 TS300 Optic Tilting
TS150 TS200 TS300 Optic Ttilting
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High Throughput

Automation includes dual end-effectors combined with dual wafer cassette holders for 150 or 200mm wafers, providing high efficiency wafer exchange and enhanced speed of test. The TS2500 can reach maximum speed of 10 Die/second (dependent upon final systems configuration) which makes it an ideal choice for production electrical tests on High Power, discrete RF devices as well as integrated circuits (ICs).

TS150 TS200 TS300 Optic Tilting
TS150 TS200 TS300 Optic Ttilting
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Advanced Alignment

Advanced alignment features such as off-axis and chuck mounted upper-looking cameras make the TS2500 an ideal platform for testing within complex RF and High Power measurement configurations. Decades of experience from MPI Photonics Automation Division making such features reliable.

TS150 TS200 TS300 Optic Tilting
TS150 TS200 TS300 Optic Ttilting
TS150 TS200 TS300 Optic Ttilting
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High Voltage, High Current and Ultra High Power Probes

MPI High Power probing solutions include the dedicated high current probes which use MPI propriety multi-contact tips for reduced contact resistance.

MPI’s high voltage probes are capable of low leakage current measurements during high voltage tests up to 3 kV triaxial or 5 kV & 10 kV coaxial set-ups.

In addition, MPI Ultra-High-Power probes provides solution for on wafer measurement of ultra-high power devices up to 10kV/600A.

Wafer Test Solution

Complete Test Solution

The TS2500 can be configured with MPI’s advanced RF / High Power accessories such as, MicroPositionersRF cablescalibration substratesTITAN™ RF probes, High Power instrument connection packages,  Taiko wafer support, or anti-arcing LiquidTray™ to ensure safe and accurate RF / High Power measurements.

And with the integration of the VNA closer to the DUT, the MPI partnership with Rohde & Schwarz, and new advanced calibration techniques, the TS2500-RF becomes a complete measurement solution that addresses the complexities of RF production test.

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