TS2500 Series – Fully Automatic Probe Systems for Production Test
Features & Benefits
Thin Wafer Handling
The unique design of TS2500 RF chucks and wafer lift pins can safely handle wafers with thickness down to 50 micrometers and thus enable testing of challenging thin III-Vs compounds wafers. The RF chucks include two auxiliary chucks constructed entirely with special ceramic material for accurate RF calibration. The auxiliary chucks may also serve to hold probe cleaning materials.
The HP chucks are manufactured with low contact resistance and gold plated chuck tops. The chucks are fully integrated assemblies and are capable of holding wafers as thin as 70 µm.
Automation includes dual end-effectors combined with dual wafer cassette holders for 150 or 200mm wafers, providing high efficiency wafer exchange and enhanced speed of test. The TS2500 can reach maximum speed of 10 Die/second (dependent upon final systems configuration) which makes it an ideal choice for production electrical tests on High Power, discrete RF devices as well as integrated circuits (ICs).
Advanced alignment features such as off-axis and chuck mounted upper-looking cameras make the TS2500 an ideal platform for testing within complex RF and High Power measurement configurations. Decades of experience from MPI Photonics Automation Division making such features reliable.
High Voltage, High Current and Ultra High Power Probes
MPI High Power probing solutions include the dedicated high current probes which use MPI propriety multi-contact tips for reduced contact resistance.
MPI’s high voltage probes are capable of low leakage current measurements during high voltage tests up to 3 kV triaxial or 5 kV & 10 kV coaxial set-ups. In addition, MPI Ultra-High-Power probes provides solution for on wafer measurement of ultra-high power devices up to 10kV/600A.
Complete Test Solution
The TS2500 can be configured with MPI’s advanced RF / High Power accessories such as, MicroPositioners, RF cables, calibration substrates, TITAN™ RF probes, High Power instrument connection packages, Taiko wafer support, or anti-arcing LiquidTray™ to ensure safe and accurate RF / High Power measurements.
And with the integration of the VNA closer to the DUT, the MPI partnership with Rohde & Schwarz, and new advanced calibration techniques, the TS2500-RF becomes a complete measurement solution that addresses the complexities of RF production test.