Device Characterization for Modeling and Process Development
Semiconductor device modeling creates models for behavior of the discrete, elementary devices (transistors, inductors, diodes, etc.) based on fundamental physics, geometry, design and operation conditions.
One of the important steps is to perform electrical on-wafer measurements of such devices and this step is general known as Device Characterization.
Driven by emergence of the new device technologies, new materials, processes development and integration, the Device Characterization process faces increasing challenges in electrical test for more and more sophisticated devices.
Basic device characterization and modeling requires accurate I-V/C-V, RF, load pull and noise measurement of devices under temperature controlled and EMI-shielded test environment.
Engineers are facing challenges such as repeatability of the measurement, reliable probe contact, external noise influences, current leakage of the probes and chucks, thermal performance of the system and correct electrical connections between the device and various instruments.
For top-side probing systems, the LEDA brand series provides high accurate movements, soft needle contact and great optical measurement structure. For bottom-side probing, the LEDA brand prober provides rigid moving table and flexible material handling methods. For single die testing, the LEDA brand prober provides the highest possible optical measurement accuracy testing under full flux environment.
MPI Engineering Probe Systems are designed to provide accurate measurement results with maximum confidence. With the dedicated Accessories such as coaxial, Kelvin, triaxial measurements connection, thermal chucks with leakage performance down to fA level over the temperature range from -60 to 300 °C and superior thermal distribution, EMI-shielded and light-tight test environment, the MPI TS2000-SE and TS200-SE are suitable for performing accurate Device Characterization.