Manual Probe Stations

Manual Probe Systems

Probe Stations

Wafer Probes

Manual Probe Systems

Wafer Probe Stations

Wafer Prober

RF Probe Stations

Manual Probe Stations

Manual Wafer Prober

300mm Manual Probe Station

Wafer Probing Station

Manual Wafer Probe Station

MPI Manual Probe Systems

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Standard Open Systems

MPI TS150, TS200 & TS300 manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.

 

They may be configured to support a wide variety of applications such as Failure Analysis, Design Validation/IC Engineering, Wafer Level Reliability, High Power, Device Characterization, MEMS and Signal Integrity as well.

High Power Systems

 

The MPI TS150-HP and TS200-HP probe systems are specifically designed for on-wafer high power device characterization testing up to 10 kV and 600 A. Dedicated chuck designs, connectors and cables are engineered to achieve low contact resistance measurements of power semiconductor under wide range of temperatures.

 

TS150-HP

Manual Wafer Probe Station

TS200-HP

High Power Wafer Probe Station

Dedicated Systems for mmW and THz Application

MPI TS150–THZ engineering probe system is a dedicated, cost effective, manual probe system designed especially for precision analysis of substrates and 150 mm wafers in sub THz range.  The system is extremely stable, with a large probe platen, and a low-profile design. Each of these essential elements are required to support a wide variety of RF and mmW applications such as broadband up to 220 GHz, banded solutions up to 1.1THz, load-pull and RF noise. 

TS150-AIT and TS200-THZ probe system expand MPI one-of-a-kind system solutions for emerging THz applications by adding active impedance tuner integrations on the same probe stations. These two systems are the industry’s first explicitly designed 150 mm and 200 mm probe systems providing accurate tests for the combination of requirements for mm-wave, THz, and automated impedance tuner applications with best possible measurement directivity.

TS150-THZ

150mm Wafer Probing Station

TS200-THZ

200mm Wafer Probing Station

Shielded Systems

The MPI TS200-SE and TS300-SE probe system incorporate the ShielDEnvironment™ providing optimal EMI shielding which allows ultra-low noise device on-wafer measurements mainly for Device Characterization and Modeling applications.

The modular design concept of all MPI manual probe systems allows a unique upgrade path towards reduced cost of ownership.

TS200-SE

200mm Wafer Probing Station with Shield Environment - low noise On-wafer measurements

TS300-SE

300mm Wafer Probing Station

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Sr. Field Service/Repair Engineer (2 openings)

Job Duties:
Responsible for repair of very high pin count (>30,000 pins) MEM's, vertical and cantilever probe cards (VPC and CPC). Replace PCB electrical components such as: Capacitors, resistors, special MUX IC. Adjust VPC space transformer flatness between MLO substrate and PCB by interposer connection. Evaluate customer feedback on probe card issue and take full card inspection to find the root cause. Provide technical support to customer’s new probe card verification on wafer sort and debug to identify setup issues, wafer product issues or program issues. Conduct training on new probe card and new technology application, including on-line clean and off-line maintenance. Contribute to probe card technical improvement to HQ production line. 30% domestic travel required (travel within US to customers’ sites for field service and repair support)

Job Requirements:
5 yrs. field service support and repair of high pin count (>30,000 pins) vertical probe card and cantilever probe card.

Send resume with Job # 202108  to CareerswithMPIAmerica@mpi-corporation.com