Optimize Your Testing
Comprehensive Devices Efficient Turnkey Solutions
State of the Art Solutions for
Advanced Wafer / DUT Automated Test, Measurement, and Inspection Technologies
for Photonics, Optoelectronics, Lasers and LED Industries
Advanced Semiconductor Test
Engineering Probe Systems
RF Probes
ThermalAir Series Temperature Forcing Systems
Environmental Test Chambers
Fast Temperature Cycling Test
-80°C to +225°C - Energy Efficient
Ultra-High Performance Probe Cards
With the Lowest Cost of Ownership
Delivering Extreme Test Capabilities
Optimize Your Testing
Optimize Your Testing
Comprehensive Devices Efficient Turnkey Solutions
Comprehensive Devices Efficient Turnkey Solutions
State of the Art Solutions for
State of the Art Solutions for
Advanced Wafer / DUT Automated Test, Measurement, and Inspection Technologies
Advanced Wafer / DUT Automated Test, Measurement, and Inspection Technologies
for Photonics, Optoelectronics, Lasers and LED Industries
for Photonics, Optoelectronics, Lasers and LED Industries
Advanced Semiconductor Test
Advanced Semiconductor Test
Engineering Probe Systems
RF Probes
RF Probes
Engineering Probe Systems
Engineering Probe Systems
ThermalAir Series
Temperature Forcing Systems
ThermalAir Series
Temperature Forcing Systems
Environmental Test Chambers
Environmental Test Chambers
Fast Temperature Cycling Test
Fast Temperature Cycling Test
-80°C to +225°C - Energy Efficient
Ultra-High Performance Probe Cards
With the Lowest Cost of Ownership
Delivering Extreme Test Capabilities
MPI Corporation has Installed its
WaferWallet®MAX for 200mm and 300mm WLR Processes
Advanced Semiconductor Test
News
Hsinchu, Taiwan, July 28, 2022
MPI Corporation’s Advanced Semiconductor Test Division, an industry and innovation leader of semiconductor test solutions initiated the integration of the TS3500-SE automated wafer probe test system with WaferWallet®MAX...
100th ARFTG Microwave Measurement Conference
Advanced Semiconductor Test
Event
Date: January 23-24, 2023
Venue: Planet Hollywood, Las Vegas, Nevada, USA
DesignCon 2023
Thermal
Event
Date: January 31 – February 02, 2023
Venue: Santa Clara Convention Center, CA, USA
Booth: 1438
OFC 2023
Photonics Automation | Advanced Semiconductor Test | Thermal
Event
Date: March 07-09, 2023
Venue: San Diego Convention Center, CA, USA
Booth: 4817
SEMICON China 2023
Photonics Automation | Advanced Semiconductor Test | Thermal | Probe Card
Event
Date: March 22-24, 2023
Venue: Shanghai New International Expo Centre, China
Booth: N3-3241
ICMTS 2023
Advanced Semiconductor Test
Event
Date: March 27-29, 2023
Venue: The University of Tokyo, Tokyo, Japan
TS2000-IFE Series – THZ Selection
Advanced Semiconductor Test
New
THZ-Selection converts the TS2000-IFE into a dedicated, RF, mmW, THZ and load-pull probe station, as first one on the market without compromising measurement directivity and accuracy at wide temperature range from -60°C to +300°C.
Celadon Multisite Tile-on-Card™ Production Probe Card
Celadon Systems
New
Functional Test, 200C, Production Probe Card
Celadon Cryogenic Minitile™
Celadon Systems
New
Cryogenic, 4K and 77K, Positioner Mounted, 22 pin Probe Card
Celadon VC20™, 45e™ Probe Card Adaptor, and Insertion Tool
Celadon Systems
New
Modular, -65C to 200C, 48 channel, probe card and adaptor, used for Modeling, Characterization, Parametric Test, and WLR testing
Celadon VC43™ and P9000 Production Parametric Probe Card
Celadon Systems
New
Modular, -65 to 200C, 100 channel, Probe Card
The Latest in mmWave and THz Test and Measurement Technology
Advanced Semiconductor Test
New
This eBook is a collection of articles on the various innovations in measurement methods and equipment that has been developed to address these higher frequencies ranging from mmWave up to 1.1 THz. (This eBook was published by Microwave Journal)
Video: Perfection comes from MPI Production
Probe Card
Video
Our probe cards' secret behind the consistent performance is that we have full control over the most important components, substrates and probes. Watch the video to find out how we do it.
