AVIOR Series
A comprehensive portfolio of prober systems for testing of optoelectronic
communication devices such as Laser Diodes and Photo Detectors
![avior series slider 1 overview](http://www.mpi-corporation.com/wp-content/uploads/slider17/avior-series-slider-1-overview.jpeg)
![avior series slider 2 tp](http://www.mpi-corporation.com/wp-content/uploads/slider17/avior-series-slider-2-tp.jpeg)
![avior series slider 3 fp](http://www.mpi-corporation.com/wp-content/uploads/slider17/avior-series-slider-3-fp.jpeg)
![avior series slider 4 dp](http://www.mpi-corporation.com/wp-content/uploads/slider17/avior-series-slider-4-dp.jpeg)
AVIOR Series Overview
The MPI AVIOR series offers a broad lineup of high performance prober systems targeting the Optical Communications market. Our prober systems are available in Top emitting (TP), Flip chip (FP) emitting and Die/Package (DP) configurations to meet your specific test requirements. Whether it be R&D or mass production, MPI has a solution that will meet your needs for accurate and reliable measurements in conjunction with a reduced cost-of-test.
MARKETS SERVED
![Optical Com.](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Markets-Served-Icon-Optical-Communication.png)
Optical Com.
AVIOR Top Prober (TP) Series Key Features
- The highly configurable lineup of wafer probers handle 2” ~ 8” wafers, with a comprehensive selection of chuck systems and probing mechanisms to choose from.
- Highly accurate electrical and optical measurements (DC/RF/Pulsed).
- Selectable contact mechanism options include: Probe Card Holder (PCH), Wedge Probe Card and MPI F1 single probe module.
- Flexible choices of precision light collection and coupling optics to meet your specific test requirements.
- MPI prober control software provides comprehensive control functions from basic wafer alignment, mapping, probe mark inspection to the deployment of MPI’s advanced Needle Alignment Mechanism (NAM) technology.
- The MPI Photonics Test System features a user-centric design that can be flexibly configured and programmed according to your unique test requirements.
Flexibility: With support for multiple test recipes, the user can flexibly select or modify the workflow or edit parameters according to the product and tests being performed.
Production Management: Manage lab/production data via the intuitive and easy-to-use software interface. Integrated real-time system monitoring and reporting enable a smooth and fully unattended test process.
Seamless Integration: With MPI’s extensive instrument library, the MPI test system can easily interface with mainstream third-party measurement instruments to meet your unique testing needs.
CAPABILITY
![Multiple Probing Mechanisms Multiple Probing Mechanisms](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Capability-Icon-Multiple-Probing-Mechanisms-1.png)
Multiple Probing Mechanisms
![Max. 8” Wafer Handling Max. 8” Wafer Handling](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Capability-Icon-Max-8-Wafer-Handling-1.png)
Max. 8” Wafer Handling
CONFIGURATION
![Semi Auto Semi Auto](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Configuration-Icon-Semi-Automation-1.png)
Semi Auto
![Fully Auto Fully Auto](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Configuration-Icon-Fully-Automation-1.png)
Fully Auto
DUT
![VCSEL VCSEL](https://www.mpi-corporation.com/wp-content/uploads/2023/02/DUT-Icon-VCSEL-1.png)
VCSEL
![PD PD](https://www.mpi-corporation.com/wp-content/uploads/2023/02/DUT-Icon-PD-1.png)
PD
AVIOR Flip-chip Prober (FP) Series Key Features
- Multiple contact mechanism options include: Probe Card Holder, Wedge Probe Card and MPI F1 single probe module.
- Flexible choices of precision light collection and coupling optics to meet your specific test requirements.
- Comprehensive support for multiple probing schemes and optical input/output orientations:
- Wafer top-side electrical probe + bottom-side optical measurement
- Simultaneous probing of wafer top/bottom surfaces - MPI prober control software provides comprehensive control functions from basic wafer alignment, mapping, probe mark inspection to the deployment of MPI’s advanced Needle Alignment Mechanism (NAM) technology.
- The MPI Photonics Test System features a user-centric design that can be flexibly configured and programmed according to your unique test requirements.
Flexibility: With support for multiple test recipes, the user can flexibly select or modify the workflow or edit parameters according to the product and tests being performed.
Production Management: Manage lab/production data via the intuitive and easy-to-use software interface. Integrated real-time system monitoring and reporting enable a smooth and fully unattended test process.
Seamless Integration: With MPI’s extensive instrument library, the MPI test system can easily interface with mainstream third-party measurement instruments to meet your unique testing needs.
CAPABILITY
![Multiple Probing Mechanisms Multiple Probing Mechanisms](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Capability-Icon-Multiple-Probing-Mechanisms-1.png)
Multiple Probing Mechanisms
![Max. 8” Wafer Handling Max. 8” Wafer Handling](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Capability-Icon-Max-8-Wafer-Handling-1.png)
Max. 8” Wafer Handling
CONFIGURATION
![Semi Auto Semi Auto](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Configuration-Icon-Semi-Automation-1.png)
Semi Auto
![Fully Auto Fully Auto](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Configuration-Icon-Fully-Automation-1.png)
Fully Auto
DUT
![VCSEL VCSEL](https://www.mpi-corporation.com/wp-content/uploads/2023/02/DUT-Icon-VCSEL-1.png)
VCSEL
![PD PD](https://www.mpi-corporation.com/wp-content/uploads/2023/02/DUT-Icon-PD-1.png)
PD
AVIOR Die Prober (DP) Series Key Features
- A wide range of configuration options perfectly designed for testing VCSELs, EELs, Packaged devices and more.
- Extremely fast probing and sorting cycle for reduced cost-of-test.
- Optimized material handling structure offers various input/output options.
- Supports a broad range of temperatures ranging from high temperature to sub-zero testing.
- Multiple test stations for mounting optical components for LIV, Near Field, and Far Field testing.
CAPABILITY
![Multiple Probing Mechanisms Multiple Probing Mechanisms](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Capability-Icon-Multiple-Probing-Mechanisms-1.png)
Multiple Probing Mechanisms
![Max. 8” Wafer Handling Max. 8” Wafer Handling](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Capability-Icon-Max-8-Wafer-Handling-1.png)
Max. 8” Wafer Handling
CONFIGURATION
![Fully Auto Fully Auto](https://www.mpi-corporation.com/wp-content/uploads/2023/02/Configuration-Icon-Fully-Automation-1.png)
Fully Auto
DUT
![VCSEL VCSEL](https://www.mpi-corporation.com/wp-content/uploads/2023/02/DUT-Icon-VCSEL-1.png)
VCSEL
![EEL](https://www.mpi-corporation.com/wp-content/uploads/2023/02/DUT-Icon-EEL-1.png)
EEL
![PD PD](https://www.mpi-corporation.com/wp-content/uploads/2023/02/DUT-Icon-PD-1.png)
PD
More Information
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