MPI’s array of optical sensing solutions are well suited for the demands of both production and engineering environments. We are ready to meet customer’s critical testing and back-end processing needs:

- Parametric Test and Measurement
- Material Handling
- Inspection
- Wafer Level Reliability Test (WLBI)

MPI optical sensing solutions have been designed to meet the entire spectrum of VCSEL designs and configurations.

- Front Emitting VCSEL
- Rear Emitting VCSEL (Flip-Chip)
- Wafer, Package, & Die Level

LIV Test

Far Field Test

Near Field Test

Automation

The Light-Current-Voltage (LIV) sweep test is a fundamental optical measurement used to determine the operating characteristics of devices such as laser diodes (LDs) and VCSELs.

MPI specializes in integrating a variety of Source and Measurement Units (SMU) providing accurate and synchronized power and voltage measurements in both pulsed (mS to nS) and CW modes.

1. High speed nanosecond test instrumentation capability
2. Electrical, Mechanical & Thermal system design to minimize the effects of self-heating, contact resistance and parasitics
3. High speed optical measurements using integrating spheres for both low and high power VCSELs

Near Field measurements are used to characterize the optical power and beam characteristics in VCSEL arrays on a per emitter basis.

MPI specializes in:

1. 1. Optical system design and integration to achieve high quality Near Field measurements for VCSELs with emitting apertures ranging from 5µm to 20µm
  2. VCSEL array characterization (Uniformity, Detection of faulty emitters and pass/fail grading)
  3. Optical Beam Characterization:
    - - Numerical Aperture (NA)
        
        Beam Diameter [D4σ (D4Sigma), D86]
        
        Beam Quality (M2) using sequenced near field imaging
  4. High speed optical measurements

MPI’s portfolio of automated test and material handling solutions readily meet the diverse needs of the optical sensing manufacturing market. Whether it be thin wafer handling, device pick and place (PnP), extreme temperature testing or production data management, MPI has a solution that will streamline your production flow and enhance product yields.

MPI specializes in:

1. Thin wafer handling solutions (Non-contact Bernoulli handler, Gel-Pak, and Carrier methods)
  Extreme temperature testing:
  - - Wafer Test: -60°C to ~200°C
    - Device Test: 0°C to 100°C
2. Production test automation and data management
  - - Flexible recipe setting with multiple test sequence support
    - Multi-die test support
    - Configuration and test data management tools