VEGA Series
High performance Laser Diode probe & test solutions
VEGA Series Overview
MPI VEGA Prober series is ready to meet the diverse test and material handling requirements of the Laser Diode (VCSEL, EEL) and optical module markets.
MPI VEGA probers are based on a highly flexible and reliable platform, enabling the test of a wide variety of device types (Wafer, Package & Singulated Die) over temperatures with the ability to handle thin/warped wafers. Multiple probing schemes are also supported with the ability to probe small pads with well-controlled needle force.
High throughput tests of key device characteristics such as LIV, Far Field, and Near Field measurements are enabled by a comprehensive test and measurement suite capable of controlling a variety of measurement instruments on the market for optimal integration.
MARKETS SERVED
Optical Com.
Optical Sensing
VEGA Top Prober (TP) Series Key Features
- Extreme temperature test capability (-40˚ to +200˚C).
- High performance loader system easily handles various device types such as thin/warped wafer, normal wafer, substrate, Packaged or other devices.
- Multiple optics / detector choices to meet your exact needs to test LIV, Near Field, and Far Field optical characteristics.
- Selectable contact mechanism options include: Probe Card Holder (PCH), Wedge Probe Card and MPI F1 Single Probe Module achieving high precision measurement.
- MPI prober control software provides comprehensive control functions from basic wafer alignment, mapping, probe mark inspection to the deployment of MPI’s advanced Needle Alignment Mechanism (NAM) technology.
- The MPI Photonics Test System features a user-centric design that can be flexibly configured and programmed according to your unique test requirements.
Flexibility: With support for multiple test recipes, the user can flexibly select or modify the workflow or edit parameters according to the product and tests being performed.
Production Management: Manage lab/production data via the intuitive and easy-to-use software interface. Integrated real-time system monitoring and reporting enable a smooth and fully unattended test process.
Seamless Integration: With MPI’s extensive instrument library, the MPI test system can easily interface with mainstream third-party measurement instruments to meet your unique testing needs.
CAPABILITY
High Temp.
Low Temp.
Flexible Optics
CONFIGURATION
Manual
Semi Auto
Fully Auto
DUT
VCSEL
PD
VEGA Flip-chip Prober (FP) Series Key Features
- Multiple contact mechanism options include: VPC, Probe Card Holder (PCH), Wedge Probe Card, and MPI F1 Single Probe Module.
- Flexible structure for mounting multiple optics system for LIV, Near Field, and Far Field testing.
- Maximum support for multiple probing schemes and optical
Input/output orientations:
- Wafer top side electrical probe + bottom side optical measurement
- Simultaneous probing of wafer top/bottom surfaces - MPI prober control software provides comprehensive control functions from basic wafer alignment, mapping, probe mark inspection to the deployment of MPI’s advanced Needle Alignment Mechanism (NAM) technology.
- The MPI Photonics Test System features a user-centric design that can be flexibly configured and programmed according to your unique test requirements.
Flexibility: With support for multiple test recipes, the user can flexibly select or modify the workflow or edit parameters according to the product and tests being performed.
Production Management: Manage lab/production data via the intuitive and easy-to-use software interface. Integrated real-time system monitoring and reporting enable a smooth and fully unattended test process.
Seamless Integration: With MPI’s extensive instrument library, the MPI test system can easily interface with mainstream third-party measurement instruments to meet your unique testing needs.
CAPABILITY
High Temp.
Low Temp.
Flexible Optics
CONFIGURATION
Semi Auto
Fully Auto
DUT
VCSEL
PD
VEGA Die Prober (DP) Series Key Features
- A wide range of configuration options perfectly designed for testing VCSELs, EELs, Packaged devices, and more.
- Extremely fast probing and sorting cycle for reduced cost-of-test.
- Supports a broad range of temperatures ranging from high temperature to sub-zero testing.
- Multiple test stations for mounting optical components for LIV, Near Field, and Far Field testing.
CAPABILITY
High Temp.
Low Temp.
Flexible Optics
CONFIGURATION
Semi Auto
Fully Auto
DUT
VCSEL
EEL
PD
More Information
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