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About MPI PC

Advanced One-Stop Wafer Sort Test Solutions


MPI Probe Card division provides a wide range of semiconductor wafer-level test solutions. IC applications include Driver, Logic, CIS, and RF, while probing on bond-pad, flip chip bump, micro-bump, and Cu pillar.

With advanced technologies to manufacture critical components, we have complete control of product consistency and precise delivery schedule management. The comprehensive designs, robust manufacturing, and state-of-the-art tooling enable us to provide unsurpassed probe cards globally.

MPI is committed to assisting our customers to maintain a competitive edge with fast, accurate responses and to deliver the highest quality test solutions.