MPI Corporation at INMMiC 2020

The International Workshop on Integrated Nonlinear Microwave and Millimetre-wave Circuits (INMMiC), July 16-17, 2020 – Virtual Conference

This week MPI participated at INMMiC 2020 virtual conference hosted online with IEEE. Here is the video describing MPI’s products and expertise showing how our systems have been developed to address in the field of nonlinear microwave and millimetre-wave circuits and systems.

ERS electronic adds PRIME 200 to their AirCool® thermal chuck family

ERS electronic adds PRIME 200 to their AirCool® thermal chuck family

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ERS electronic and MPI Corporation are now offering a 200 mm version of their popular thermal chuck AirCool® PRIME.

 

MUNICH, MAY 14th, 2020 – ERS electronic GmbH, the industry-leading manufacturer of thermal management solutions for the semiconductor market will offer its customer-favorite AirCool® PRIME for 200 mm wafer format.
Following the success of the 300 mm version, the innovation leader has added a 200 mm counterpart, promising the same performance in a smaller form factor.

The cutting-edge PRIME technology is the result of collaboration with prober manufacturer MPI Corporation and was rolled out in beginning of 2018. Two years later, thanks to PRIME’s many unique features lowering the cost of test without compromising performance, it remains at the forefront of thermal testing technology. Among the unique features are ultra-low noise (ULN) capability in the single-digit Femto-Ampere (fA) range along with the industry’s shortest soak time.

The system can be configured for temperatures ranging from -65°C to 300°C and is ideal for testing both high frequency and high voltage applications. Through the PRIME Thermo Shield (PTS) and a unique “mini-environment” around the wafer, the transition times and stabilization time after temperature change have been significantly reduced, resulting in shorter overall test times.

The AirCool® PRIME 200 is predicted to become a popular format for new materials like Silicon Carbide (SiC). It is easy-to-use, has a changeable top plate and includes several upgrade paths in temperature and vacuum surface configurations.

“MPI is excited to offer the 200 mm PRIME technology with the most versatile thermal range and built-in field upgradability. The system covers various applications including, but not limited to, ultra-low noise, 1/f, RTN, RF, mmW and high-power accurate measurements,” says Stojan Kanev, General Manager of MPI Corporation’s Advanced Semiconductor Division. “Another great example of lowering the cost of test, reducing footprint, soak time and keeping the CDA consumption for the whole system (chuck + prober) lower than other systems in the market. This ultimately demonstrates the power behind MPI and ERS in developing customer-oriented solutions.”

“We are very proud to see that the PRIME technology has become a favorite in the thermal test industry, and is being widely used for wafer probing of connectivity and electromobility devices. Adding the 200mm version will help accelerate market growth,” says CEO Laurent Giai-Miniet. “The analytical wafer probing market remains the most challenging space in wafer test, and is the main target for ERS innovation. Working with MPI Corporation has been instrumental in bringing advanced Thermal Solutions to the market.“

The PRIME 200 chucks can be ordered for all MPI 200 mm manual, automated and fully-automated probe stations.

 

About ERS:

ERS electronic GmbH, based around Munich, has been producing innovative thermal
test solutions for the industry for nearly 50 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate air cool-based thermal chuck
systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related
and manufacturing tests. Today, thermal chuck systems developed by ERS such as AC3, AirCool® PRIME, AirCool® and PowerSense® are integral components in all larger-sized
wafer probers across the semiconductor industry.

 

For more information, please visit: https://www.ers-gmbh.com/

 

About MPI Corporation:

 

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of divisional product technologies stimulates MPI product innovations that are meaningful to our precious customer base. MPI is the first TPEx listed probe card company in Taiwan.

 

For more information, please visit: www.mpi-corporation.com

MPI Corporation at ICMTS 2020

MPI Corporation at ICMTS 2020

33rd IEEE International Conference on Microelectronic Test Structures (ICMTS), May 4-17, 2020 – Virtual Conference

This week MPI participated at ICMTS 2020 virtual conference hosted online with IEEE. Here is a short video introducing MPI’s products and expertise showing how our systems have been developed to address a wide range of challenges surrounding device characterization and measurement analysis.

MPI Introduces Unique NoiseShield™ Option for 1/f (Flicker) & RTN Measurements

Taiwan, Sept.18 th, 2019 – MPI introduced a new NoiseShield™ option, which provides excellent EMI-shielding, low impedance grounding and shortest possible cable lengths to reduce parasitic capacitance and to maximize the test system roll-off frequency. It reduces external magnetic field influences on the measurement results and makes the 1/f, RTN setup more robust and test lab location less-independent. It makes the probe station completely “invisible” and enables the measurement results down to the physical limit of the test instrumentation.

 

“The MPI NoiseShield™ is the next step in providing a high value solution for 1/f measurements.” Said Toe Naing Swe, Director Device Modeling, at MPI Advanced Semiconductor Test Division. “In combination with the MPI ShielDEnvironment™, users can now experience excellent EMI-Shielding for not only device under test (DUT) and the measurement instrument (such as pre-amplifier unit of ProPlus 9812DX), it also includes all cables and connectors. The fully integrated solution also shortens the cables by placing the LNA very close to DUT. Installed on TS3500-SE with MPI WaferWallet®, customers can now perform, for the first time ever, unsurpassed fully-automated 1/f measurements. MPI SENTIO® Software Suite includes native drivers for the ProPlus Design Solutions product suite, such as BSIMProPlus™ and NoiseProPlus™, making such automation out of the box easy.”

 

“The MPI prober is excellent and best I have ever worked with”, said Dr. Zhihong Liu, CEO and Co-Founder of ProPlus Design Solutions Inc. “For noise measurement, it gives the best performance both in shielding and reduction in parasitics. With it, we are able to reach the limit of our system without trade-offs. Using the High Precision LNA in 9812DX, we can get to the floor noise of 3e-27 A^2/Hz with >20KHz bandwidth and accurately monitor the bias current down to pA level simultaneously. It can also measure down to 0.1Hz in the low frequency end without the introduction of mechanical vibration. Using the MPI prober, we also measured a MOSFET with 10MHz on-wafer bandwidth and the noise level is reaching to our Wideband LNA noise floor.”

 

About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of divisional product technologies stimulates MPI product innovations that are meaningful to our precious customer base.

 

For more information please visit: www.mpi-corporation.com

 

About ProPlus Design Solutions

ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the leading provider of nano-scale SPICE modeling, the innovative giga-scale SPICE simulation and design for yield (DFY) applications, it provides the industry’s golden SPICE modeling platform, the first and only GigaSpice simulator, and the only integrated DFY design platform. Founded in 2006, ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China.

 

For more information, please visit: www.proplussolutions.com

Testimonial from Georgia Tech

Testimonial from Georgia Tech

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October 2019   

To whom it may Concern;

Recently, when shopping for a probe station for my mmWave and TeraHertz research work, I was approached by MPI Corporation (Taiwan) to consider their offerings. Never having any experience with their products, I was naturally skeptical. When I engaged with their technical support personnel, I found that their understanding of the issues involved, coupled with the explanation of how their design addressed those concerns, seemed excellent, so I took the chance.

Now, with delivery of my system completed, I have found that they truly recognize the critical aspects of our state-of-the-art research, and have manufactured a probe station that addresses my current and future needs. The design, innovation and quality, that they have put into this prober is excellent, along with the technical support that I have received.

 

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Hua Wang, Ph.D.

 

Demetrius T. Paris Junior Professor
Assistant Professor
School of Electrical and Computer Engineering
Georgia Institute of Technology

Associate Editor of IEEE Microwave and Wireless Components Letters
IEEE Atlanta Section CAS/SSCS Chapter Chair

777 Atlantic Drive, N.W.
Atlanta, GA 30332-0250 USA; Ph:(404) 385-6003
http://www.ece.gatech.edu/research/labs/gems/

School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta, Georgia 30332-0250  U.S.A.
PHONE  404•894•2901   FAX  404•894•4641

A Unit of the University Systems of Georgia          
An Equal Education and Employment Opportunity Institution

Product Testimonial

Qualcomm Builds 5G Ecosystem in Taiwan Enabling Taiwan Supply Chain Access to 5G Economic Benefits

Qualcomm Builds 5G Ecosystem in Taiwan Enabling Taiwan Supply Chain Access to 5G Economic Benefits

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Roawen Chen, Qualcomm’s Senior Vice President of Manufacturing Technology and Operations.
(Image Source: Qualcomm)

 

The American enterprise Qualcomm held a groundbreaking ceremony for their new building on June 27th, 2019. The 5G technical laboratory officially launched its strategic planning in Taiwan to bolster the overall technical strength of Qualcomm in Taiwan. This effort will surely strengthen Qualcomm’s cooperation with Taiwan’s supply chain. It is expected that Qualcomm’s 5G business will experience rapid growth also benefiting the participating partners.

 

Chi-mai Chen, Vice Premier of the Executive Yuan, Yu-chin Hsu, Deputy Minister of the Ministry of Science and Technology, Chuan-neng Lin, Vice Minister of Ministry of Economic Affairs, and Mei-ying Huang, Chairperson of the Fair Trade Commission participated in the event. It is understood that Qualcomm spent a total of NT $5.5 billion to build the new structure, having an area of more than 7,270 square meters. Construction of the new building will be completed within two years, and is expected to be hold more than 1,000 employees.

 

In addition, Qualcomm’s Center for Operations, Manufacturing Engineering and Testing in Taiwan (COMET), the 5G Testing Laboratory, the Multimedia R&D Center, and the Mobile Artificial Intelligence Innovation Center will all be stationed in the new building. This is the first time that Qualcomm has constructed a new facility of this magnitude overseas without requiring rental space.

 

Roawen Chen, Senior Vice President of Manufacturing Technology and Operations of Qualcomm indicated that the construction of a new building in Taiwan’s Hsinchu Science Park means that the collaboration between Qualcomm and Taiwan’s ICT (information and communications technology) industry has marked a new milestone. S.T. Liew, Taiwan and South East Asia President of Qualcomm stated, “Qualcomm is devoted to working closely with Taiwanese industry in capturing global business opportunities. The company will continue to support the rapid development of Taiwan’s wireless communication and semiconductor ecosystem.” 

 

It is also the first time for Qualcomm to showcase its 5G laboratory in Taiwan, including 5G radio frequency (RF) IC testing, 5G module lab, biometric recognition sensing advance center and millimeter wave advance center. The equipment of these labs and centers was installed in the new building during 1H19. It is expected that more than 100 engineers will be recruited, and the scale of Qualcomm’s Taiwan 5G laboratory will continue to expand.

 

The Hsinchu Science Park’s supply chain includes IC design houses, wafer foundry and testing, etc. Once in full swing, Qualcomm’s 5G efforts is expected to increase the orders for Taiwanese vendors.   

 

As for the specific systems, besides purchasing test equipment from overseas vendors such as ADVANTEST, Qualcomm’s 5G Lab has also includes systems from MPI Corporation’s Advanced Semiconductor Test (AST) division. The lab is mainly for the testing of power amplifier (PA) chipsets with revenue benefits for all participants within Qualcomm’s 5G ecosystem.

 

Note: This press release is translated to English by MPI Corporation.

News Source: https://www.chinatimes.com/newspapers/20190628000234-260202?chdtv