Thermal Test Equipment –  Thermal Test Equipment –  Environmental Test Chamber –  Thermal Test Systems  –  Test Chambers

 Thermal Shock – Temperature Forcing Systems –  Temperature Test Chambers –  Environmental Test Chambers –  Temperature Chambers

Telecommunications Test Applications

Temperature forcing systems and environmental test chambers are part of the final temperature test process. These environmental tests help with failure analysis by thermally stressing the device throughout the design and manufacturing process to assure product quality and reliability.

TA-5000A w/ Glass Cap
-80°C / +225°C
-25°C / +200°C
TA-3000A w/ Glass Cap
-60°C / +225°C

-100°C / +300°C



ThermalAir Stream Temperature Forcing Systems Hot and Cold Testing


MPI Thermal cutting-edge technology allows testing with temperatures speeding to super-fast ramp rates and temperature cycling for MIL-STD -55°C to +125°C.

MPI ThermalAir systems can ramp in seconds not minutes. This new thermal test technology gives the end user the ability to easily control the ramp rate speed with one touch temperature set point functions.

The ThermalAir systems bring the temperature hot and cold directly to your electronic and non-electronic parts. This enables you to bring the temperature to the test station in the engineering test lab and manufacturing test on the production line.

Temperature Forcing System

5th Generation (5G) Telecommunications Uses Gigahertz (GHz) Wavelengths

The Telecommunications Industry promises fast and unlimited mobile internet access with the next generation of 5G technologies. This 5G technology is designed to provide faster downloads, streaming movies, wireless virtual reality, in addition to being the platform for the Internet of Things. 5G will mainly be used for more immersive entertainment and surveillance with much greater public exposure, especially in “Smart Cities”.  Military uses have also been discussed. This 5th generation (5G) systems use high frequency with Gigahertz (GHz) wavelengths in the millimeter range.

Since 5G technology is more and more exposed to outdoor outside environments, manufacturers of these high speed 5G devices for automotive, military, defense, commercial, industrial and consumer 5G electronics require temperature conditioning, thermal cycle and other temperature testing parameters are needed in product development.

In the Telecommunications Industry, electronic components and equipment must be tested to confirm that everything functions properly as a system. In the telecommunications manufacturing  process, individual components, modules, and other components need be temperature tested to assure reliability.  Each piece needs to be designed to work when exposed to harsh temperature environments.

TA-5000A w/ Glass Cap
-80°C / +225°C
TA-3000A w/ Glass Cap
-65°C / +225°C
-25°C / +200°C

Temperature Forcing Systems –  Environmental Test Chambers –  Temperature Test Chambers –  Environmental Test Chambers –  Temperature Chambers

ThermalAir TA-5000 Temperature Test Systems

When localized thermal test and accurate temperatures are needed, the ThermalAir products can meet requirements that most environmental chambers cannot. Our ThermalAir products provide uniform methods to generate hot and cold temperature for telecom and RF microwave components from -55°C to +125°C.

ThermalAir Temperature Test Systems are used as part of the test for telecom equipment destined for certain networks in outside environments that need to be tested at hot and cold temperatures. This is to assure telecom systems, microwave RF and other telecommunication parts work when exposed to outside environments.

ThermalAir Temperature Forcing Systems with Localized Test Chambers Applications Used





  • Life Test
  • Infant Mortality
  • Product Design
  • Temperature Conditioning 
  • Incoming Inspection
  • Thermal Profiling
  • Thermal Stress
  • Thermal Cycling


 Thermal Test Systems  – Temperature Forcing Systems –  Environmental Test Chamber –  Thermal Test Equipment – Temperature Test Chamber

MPI Thermal Temperature Testing Products

Telecommunication components and hardware need environmental temperature, vibration, and humidity testing. Thermal cycling, temperature conditioning, and environmental stressing of devices is considered vital to reliability and durability to meet user’s operating requirements in the field of use.

Whether it’s thermal profiling, temperature cycling, thermal shock, or test conditioning, ThermalAir Temperature Test Systems can help with your temperature requirements.


ThermalAir Thermal Test Systems for Fiber Optic Component Manufacturers

The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.

ThermalAir Systems for Automotive Temperature Test Applications

  • One system fits all temperature ranges -80°C to +225°C
  • Plug in anywhere 200 to 25OVAC, 20amp, 50/60Hz
  • Up to 24 SCFM continuous airflow capacity Hot & Cold
  • Fastest temperature ramp rates without the use of LN2 or CO2
  • Systems are easily moved for sharing between workstations or testers.
TA1000 Temperature Cycling Test System | Thermal Cycling Test | Temperature Cycling Test Equipment |Thermal Cycling

Environmental Stress Testing

Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.


ThermalAir Systems for Fiber Optic Components, Parts, and Accessories

The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.

Temperature Forcing System

MPI ThermalAir temperature forcing systems provide a direct thermal stream of clean dry hot and cold air directly to the part that needs to be thermal tested. In the lab or on the production floor, ThermalAir Series provide unparalleled thermal stress testing  capabilities for scientist and engineers.

The ThermalAir system allows you to generate very precise controlled temperature for simulation test in Thermal Shock, Temperature Conditioning, Stress Screening, Temperature Cycling and more. Thermal test processes can be accomplished with our ThermalAir system. Ramp, Cycle, Dwell and Soak times are fully programmable with a touch of a button.


The ThermalAir TA-5000 Accessories & Thermal End Effectors

The ThermalAir TA-5000 Series Temperature Forcing System offers a fully array of accessories to help customize your thermal test application.

Test Chambers

Thermal Accessories

ThermalAir Product Line


Sr. Field Service/Repair Engineer (2 openings)

Job Duties:
Responsible for repair of very high pin count (>30,000 pins) MEM's, vertical and cantilever probe cards (VPC and CPC). Replace PCB electrical components such as: Capacitors, resistors, special MUX IC. Adjust VPC space transformer flatness between MLO substrate and PCB by interposer connection. Evaluate customer feedback on probe card issue and take full card inspection to find the root cause. Provide technical support to customer’s new probe card verification on wafer sort and debug to identify setup issues, wafer product issues or program issues. Conduct training on new probe card and new technology application, including on-line clean and off-line maintenance. Contribute to probe card technical improvement to HQ production line. 30% domestic travel required (travel within US to customers’ sites for field service and repair support)

Job Requirements:
5 yrs. field service support and repair of high pin count (>30,000 pins) vertical probe card and cantilever probe card.

Send resume with Job # 202108  to