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 Environmental Test Chambers –  Thermal Test Systems –  Temperature Testing Chamber –  Thermal Test Systems  –  Temperature Chambers

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 Thermal Test Equipment – Temperature Forcing Systems –  Test Chambers –  Thermal Test Systems  –  Temperature Test Chambers

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In the manufacturing of semiconductors electronic components for harsh environments, the IC package assembly and test stages of engineering and production include burn-in, electronic hot and cold testing at temperature, and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications, can get exposed to extreme environmental conditions.

Product engineers and test engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).

The ThermalAir TA-5000 has a temperature range from -80°C to +225°C without the use of LN2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in. This lets you easily temperature test your electronic semiconductor IC devices.

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 Environmental Test Chambers –  Thermal Test Systems –  Environmental Test Chamber –  Environmental Test Chambers –  Temperature Chambers– Temperature Test Chamber

Environmental Stress Testing

Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.

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Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature System enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.

Bring temperature to your test for Semiconductor IC devices and other semiconductor packages. ThermalAir forcing systems are used for semiconductor devices from Consumer Electronics to Aerospace and Defense applications ( mil aero MIL-STD 883 ) temperature range of -55°C to +125°C.

Temperature Forcing System

Temperature Forcing System

Some Applications

 

  • Product Engineering
  • Back-End Test
  • Incoming Inspection
  • IC Handler Verification
  • Functional Test
  • Cooling the IC while Stress Full Cycle
  • Failure Analysis
  • Final Test

And More…

Temperature Test Systems | Temperature Test Systems | Test Chambers | Test Chambers | Temperature Test Equipment | Temperature Test | Environmental Test Chambers

Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.

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Temperature Testing Semicondcutor ICs

In the manufacturing of semiconductors electronic components for harsh environments, the IC package assembly and test stages of engineering and production include burn-in, electronic hot and cold testing at temperature, and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications, can get exposed to extreme environmental conditions.

The ThermalAir TA-5000 has a temperature range from -80°C to +225°C without the use of LN2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in. This lets you easily temperature test your electronic semiconductor IC devices.

Environmental Stress Testing

Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.

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Some Applications

  • Product Engineering
  • Back-End Test
  • Incoming Inspection
  • IC Handler Verification
  • Functional Test
  • Cooling the IC while Stress Full Cycle
  • Failure Analysis
  • Final Test

And More…

Temperature Forcing System

Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.

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The ThermalAir TA-5000 Accessories & Thermal End Effectors

The ThermalAir TA-5000 Series Temperature Forcing System offers a fully array of accessories to help customize your thermal test application.

Test Chambers

Thermal Accessories

ThermalAir Product Line

error:

Sr. Field Service/Repair Engineer (2 openings)

Job Duties:
Responsible for repair of very high pin count (>30,000 pins) MEM's, vertical and cantilever probe cards (VPC and CPC). Replace PCB electrical components such as: Capacitors, resistors, special MUX IC. Adjust VPC space transformer flatness between MLO substrate and PCB by interposer connection. Evaluate customer feedback on probe card issue and take full card inspection to find the root cause. Provide technical support to customer’s new probe card verification on wafer sort and debug to identify setup issues, wafer product issues or program issues. Conduct training on new probe card and new technology application, including on-line clean and off-line maintenance. Contribute to probe card technical improvement to HQ production line. 30% domestic travel required (travel within US to customers’ sites for field service and repair support)

Job Requirements:
5 yrs. field service support and repair of high pin count (>30,000 pins) vertical probe card and cantilever probe card.

Send resume with Job # 202108  to CareerswithMPIAmerica@mpi-corporation.com