Thermal Test Equipment –  Thermal Test Equipment –  Environmental Test Chamber –  Thermal Test Equipment –  Temperature Chambers

 Thermal Test Systems  –  Thermal Test Equipment –  Temperature Testing Chamber –  Thermal Test Systems  – Temperature Test Chamber

 Thermal Test Systems  –  Thermal Shock –  Test Chambers –  Environmental Test Chambers –  Temperature Testing Chamber

 Thermal Test Equipment –  Thermal Test Systems –  Temperature Chambers –  Thermal Test Equipment –  Test Chambers

In the manufacturing of semiconductors electronic components for harsh environments, the IC package assembly and test stages of engineering and production include burn-in, electronic hot and cold testing at temperature, and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications, can get exposed to extreme environmental conditions.

Product engineers and test engineers in the lab and on the semiconductor production floor use and share the ThermalAir temperature forcing systems to bring their devices to temperature ranges from -55°C to +125°C. ThermalAir environmental temperature test systems generate a hot and cold air stream directly on the device under test (DUT).

The ThermalAir TA-5000 has a temperature range from -80°C to +225°C without the use of LN2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in. This lets you easily temperature test your electronic semiconductor IC devices.

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 Temperature Cycling Test – Temperature Forcing Systems –  Temperature Chambers –  Environmental Test Chambers –  Temperature Testing Chamber –  Environmental Test Chamber

Environmental Stress Testing

Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.

Thermal Air Forcing
Thermal Glass Cap Enclosure
Rectangle Thermal Glass Cap

Rectangle Thermal Glass Cap w/ Dry Purge Base
System Thermal Head Accessories
Thermal Air Accessories
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Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature System enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.

Bring temperature to your test for Semiconductor IC devices and other semiconductor packages. ThermalAir forcing systems are used for semiconductor devices from Consumer Electronics to Aerospace and Defense applications ( mil aero MIL-STD 883 ) temperature range of -55°C to +125°C.

Temperature Forcing System

Temperature Forcing System

Some Applications

 

  • Product Engineering
  • Back-End Test
  • Incoming Inspection
  • IC Handler Verification
  • Functional Test
  • Cooling the IC while Stress Full Cycle
  • Failure Analysis
  • Final Test

And More…

Thermal Shock | Test Chambers | Environmental Test Chambers | Temperature Test Systems | Temperature Test | Temperature Forcing Equipment | Temperature Test Systems

Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.

Onscreen User Manual
Datalog Screen

Easy Icon at a touch
Cycle Screen
Main Operator Screen
Dual Touch Screens
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Temperature Testing Semicondcutor ICs

In the manufacturing of semiconductors electronic components for harsh environments, the IC package assembly and test stages of engineering and production include burn-in, electronic hot and cold testing at temperature, and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications, can get exposed to extreme environmental conditions.

The ThermalAir TA-5000 has a temperature range from -80°C to +225°C without the use of LN2 or CO2. Our portable self-contained thermal inducing systems only need to be plugged in. This lets you easily temperature test your electronic semiconductor IC devices.

Environmental Stress Testing

Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.

Some Applications

  • Product Engineering
  • Back-End Test
  • Incoming Inspection
  • IC Handler Verification
  • Functional Test
  • Cooling the IC while Stress Full Cycle
  • Failure Analysis
  • Final Test

And More…

Temperature Forcing System

Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.

Field Application Engineer

Job Location: San Jose, CA

Job Duties:

  • Assist in developing HW and SW measurement methodologies/solutions for analytical wafer probe solutions with signal applications from DC to millimeter wave frequencies as well as Silicon Photonics (SiPH);
  • Collaborate with customers on their measurement challenges, and provide applications specific product training;
  • Provide pre- and post-sale support to AST, customers, service department, and the sales channel developing HW and SW measurement solutions for analytical wafer probe stations;
  • Define application-specific solutions based on customer-provided device data and facilitate both customer and divisional teams to successful results;
  • Perform product training seminars for customer and sales channels as well as participate in trade shows and technical seminars;
  • Make recommendations regarding product improvement, new products, and quality enhancement;
  • Author, document, publish, and present measurement solutions via Seminars, Applications Notes, Briefs, and White Papers;
  • Prepare, plan, and assist with customer product demonstrations that highlight value-based differentiation of AST product offerings;
  • Develop unique and individual customer presentations designed to professionally position the MPI brand in the North American market and deliver formal presentations to customers.

Job Requirements:

Master’s degree in Electrical Eng., Electronics Eng., Physics, or Photonics; Must possess 6 months of relevant work experience; Travel to customers’ sites in US and headquarters in Taiwan is required.

Send resume to: MPI America, Inc., 2360 Qume Drive, Suite C, San Jose, CA 95131, Attn: Janet Chiang