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Temperature Cycling Optical Transceivers – Accelerated Stress Testing –  Temperature Chambers –  Reliability Testing – Thermal Testing Optical Transceivers | Thermal Management

{[wpts_spin] 100G Optical Transceiver – Temperature Conditioning –  Temperature Testing Chamber –  Accelerated Life Testing –  Testing 40G Optical Transceivers | Temperature Inducing Systems

{Thermal Testing Optical Transceivers | 100G Optical Transceiver | 40G Optical Transceivers | Temperature Cycling Optical Transceivers | Testing 40G Optical Transceivers | Temperature Test 100G} – {Temperature Forcing Systems | Thermal Test Systems | Temperature Testing Optical Recievers | Temperature Cycling Test | Thermal Test Equipment | Thermal Test Fiber Optics } – {Temperature Test Chamber | Temperature Test 5G | Test Chambers | Temperature Test 100G Transcievers | Temperature Testing Chamber | Temperature Chambers} – {Temperature Forcing Systems | Thermal Test Optical Transceivers | Environmental Test Chambers | Temperature Cycling Test | Thermal Test Equipment | Stress testing Optical Transvievers} – {Thermal Testing Optical Transceivers | 100G Optical Transceivers | 40G Optical Transceivers | Temperature Cycling Optical Transceivers | Testing 40G Optical Transceivers | Temperature Test 100G}

Temperature Cycling Optical Transceivers – Thermal Profiling – Temperature Test Chamber –  Accelerated Stress Testing –  Temperature Cycling Optical Transceivers | HASS Testing

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Fiber Optic Temperature Applications

Fiber Optic Transceiver manufacturers test these devices to assure optical transceivers circuits work at certain temperatures. This is to guarantee reliability of these high speed fiber optic transceivers used within the communication high speed network and data center industries.

-60°C / +225°C
-80°C / +225°C
-25°C / +200°C

-100°C / +300°C

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Fiber Optic Temperature Applications

Fiber Optic Transceiver manufacturers test these devices to assure optical transceivers circuits work at certain temperatures. This is to guarantee reliability of these high speed fiber optic transceivers used within the communication high speed network and data center industries.

-60°C / +225°C
-80°C / +225°C
-25°C / +200°C

-100°C / +300°C

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Temperature Test 100G – Accelerated Stress Testing –  Temperature Chambers –  Accelerated Stress Testing –  40G Optical Transceivers

ThermalAir TA-Series of
Temperature Forcing Systems

ThermalAir Temperature Test Systems are used for fiber optic manufacturing final test applications in engineering development and production at temperature ranges from -40°C to +90°C to thermal test and temperature calibrate these devices at precise temperatures.

ThermalAir TA-5000 -80°C to +225°C, TA-3000 -60C° to +225°C  and TA-1000 -25°C to +200°C temperature inducing equipment provides a controlled temperature of hot and cold air directly on the fiber optic component under test with temperatures ranging from -80°C to +225°C with an accuracy of +/- 1.0°C for fiber optic components.

Fiber Optic Components

Commercial SFPs and other Fiber Optic components are designed to withstand temperatures between 0°C and 70°C. Some of RAD’s SFPs are industry hardened versions, designed and tested to operate from -40°C to +90°C at a temperature margin within the set point better than +/- 1.0°C. These and other families of Fiber Optic Transceivers specified temperature ranges may vary according to where the product in which the Fiber Optic Component SFP and others are used.

  • Industrially Hardened
  • DDM Calibration
  • External DDM Calibration
  • And More Advance specification requirements 

Learn More

ThermalAir Systems for SFP Fiber Optic Transceiver

Thermal Test Applications

The small form-factor pluggable (SFP) is a compact, hot-pluggable network interface module used for both telecommunication and data communications applications. … SFP transceivers exist supporting SONET, Gigabit Ethernet, Fibre Channel, PON, and other communications standards.

 

MPI Thermal air stream systems meet the temperature test standards for fiber optic 25G, 40G, 100G transceivers. Our ThermalAir products provide uniform methods to generate hot and cold temperature for fiber optic transceivers common temperature test range of -40°C to +90°C.

ThermalAir TA-5000 system controls temperature for testing microelectronic and other electronic and non-electronic materials. This assures your parts are suitable for use within industrial, commercial and consumer electronic systems. These include basic temperature tests to determine characteristics of these fiber optic transceivers / laser devices over temperature.

Testing 40G Optical Transceivers – Accelerated Stress Testing –  Temperature Test 5G – HALT/HASS –  Temperature Cycling Optical Transceivers

Standard environmental test chambers cannot meet the narrow temperature accuracy margins for 25G, 40G, 100G and 400G fiber optic transceiver.

ThermalAir systems produce a hot and cold stream of air at very fast ramp rates directed on the device under test with very precise thermal control, providing a temperature range from -80°C to +225°C with an accuracy of +/- 1.0°C for fiber optic transceivers and other high speed electronic components.

Learn More

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MPI Thermal temperature inducing equipment is portable and can easily be moved from one test station to another. Fiber Optic Component manufacturers can use our ThermalAir TA-5000 system to quickly bring their parts to temperature right at the test location. Temperature cycling, thermal profiling and other environmental temperature conditioning is why MPI Thermal systems are part of the manufacturing temperature test processes.

Temperature cycling, thermal profiling and other environmental temperature conditioning is why MPI Thermal systems are part of the manufacturing temperature test process.

This is why the MPI Thermal TA-5000 Series of ThermalAir temperature products are part of the test.

Learn More

ThermalAir Thermal Test Systems for Fiber Optic Component Manufacturers

The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.

ThermalAir Systems for Automotive Temperature Test Applications

  • One system fits all temperature ranges -80°C to +225°C
  • Plug in anywhere 200 to 25OVAC, 20amp, 50/60Hz
  • Up to 24 SCFM continuous airflow capacity Hot & Cold
  • Fastest temperature ramp rates without the use of LN2 or CO2
  • Systems are easily moved for sharing between workstations or testers.
TA1000 Temperature Cycling Test System | Thermal Cycling Test | Temperature Cycling Test Equipment |Thermal Cycling

Environmental Stress Testing

Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.

ThermalAir Systems for Automotive Electronics, Parts, and Accessories

The design challenges go well beyond simply delivering processing power and high-speed data transfer. Design engineers must also safely manage heat generated by those processes in the confines of tight vehicle packaging requirements, as well as ambient and cold temperature fluctuations, while adhering to stringent safety and reliability standards of the automotive industry.

Temperature Forcing System

MPI ThermalAir temperature forcing systems provide a direct thermal stream of clean dry hot and cold air directly to the part that needs to be thermal tested. In the lab or on the production floor, ThermalAir Series provide unparalleled thermal stress testing  capabilities for scientist and engineers.

The ThermalAir system allows you to generate very precise controlled temperature for simulation test in Thermal Shock, Temperature Conditioning, Stress Screening, Temperature Cycling and more. Thermal test processes can be accomplished with our ThermalAir system. Ramp, Cycle, Dwell and Soak times are fully programmable with a touch of a button.

Learn More

Space Tech Expo 2022
LEARN MORE

Date: June 21 – 23, 2022

Booth:#9058

Venue: Long Beach Convention & Entertainment Center

International Microwave Symposium
(IMS) 2022

News

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MPI Thermal Divisional Overview
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LEARN MORE

Take a tour of the exclusive MPI Thermal 3D Virtual Booth to explore the full product portfolio of ThermalAir TA-Series of Temperature Testing Systems.

MPI Thermal Accessories

MPI Thermal Cycling Test Chambers
LEARN MORE

Clamshell Style compact test chamber in standard and custom dimensions for many size devices and components in Aerospace, Semiconductor, RF Microwave, Automotive electronic, Fiber Optic Components

MPI Thermal Cycling Test Chambers

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LEARN MORE

The ThermalAir Series of temperature test systems brings precise thermal testing capabilities directly to your test application. In the test engineering lab or on the production test floor

MPI Thermal Product Line and
Models Configuration Overview

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SAVE & ACCEPT

Field Application Engineer

Job Location: San Jose, CA

Job Duties:

  • Assist in developing HW and SW measurement methodologies/solutions for analytical wafer probe solutions with signal applications from DC to millimeter wave frequencies as well as Silicon Photonics (SiPH);
  • Collaborate with customers on their measurement challenges, and provide applications specific product training;
  • Provide pre- and post-sale support to AST, customers, service department, and the sales channel developing HW and SW measurement solutions for analytical wafer probe stations;
  • Define application-specific solutions based on customer-provided device data and facilitate both customer and divisional teams to successful results;
  • Perform product training seminars for customer and sales channels as well as participate in trade shows and technical seminars;
  • Make recommendations regarding product improvement, new products, and quality enhancement;
  • Author, document, publish, and present measurement solutions via Seminars, Applications Notes, Briefs, and White Papers;
  • Prepare, plan, and assist with customer product demonstrations that highlight value-based differentiation of AST product offerings;
  • Develop unique and individual customer presentations designed to professionally position the MPI brand in the North American market and deliver formal presentations to customers.

Job Requirements:

Master’s degree in Electrical Eng., Electronics Eng., Physics, or Photonics; Must possess 6 months of relevant work experience; Travel to customers’ sites in US and headquarters in Taiwan is required.

Send resume to: MPI America, Inc., 2360 Qume Drive, Suite C, San Jose, CA 95131, Attn: Janet Chiang

 

 

 

2010-Merill-Lynch

2010-MPI-Co.presentation-material

2010-presentation-material

          2010-0830-Yuanta Security 2010 NDR          

2010-Taiwan-Technology-Conference

20100923-MPI-Presentation

2010_MPI_OTC-Presentation20101104

 

 

2011-Waterland-Financial-Holdings-Technical-Conference

2011-Credit-Suisse-Asian-Technology-Conference

2011-BoA-Merrill-Lynch-Conference

2011-Masterlink-Security-NDR-April-1820th

         2011_Microsoft-PowerPoint-MPI_Bank-of-America-Merrill-Lynch-20110315         

2011_MPI_citigroup-corporate-days20110308

 

 

       2012-Microsoft-PowerPoint-2012-Merrill-Conference      

2012-MPI Corporation

2012-MPI-2012-Citi-Conference

 

2013-MPI_CA_NDR_201309009

       2013-BoA-Conference_MPI_20130312      

2013-MPI Corporation RBS_NDR

 

 

2014-MPI Corporation

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         2015 J.P.Morgan Global TMC Conference Hong Kong         

2015 Credit Suisse Asian Technology Conference

2015 MPI 2015 Mar

 

 

2016 Credit Suisse 17th Annual Asian Technology Conference

2016 KGI Corporate Day Conference

    2016 Asia Pacific TMT Conference (TTB)-Bank of America Merrill Lynch    

 

 

2017 Goldman Sachs Taiwan Equipment and Automation Day

2017 Bank of America Merrill Lynch-Asia Pacific Telecom, Media & Technology Conference

2017 MPI Corp. is invited by Taipei Exchange to present the business outlook

    2017 MPI is invested to participate BNP Paribas’s 8th Asia Pacific TMC Conference to present company’s business outlook    

2017 MPI is invited to participate Masterlink Securities’ Taiwan Corporate Day in Tokyo to present our business outlook

MPI is invested to participate Yuanta Securities’ Asia Investment Forum

2017 MPI is invited to participate Cathay Securities Corporation’s 2Q17 Greater China Summit

 

 

 

    2018 MPI is invited to attend Bank of America Merrill Lynch Asia Pacific Telecom, Media & Technology Conference    

2018 MPI is invited to attend KGI Securities Investor Conference

 

 

          2019 MPI is invited to attend Bank of America Merrill Lynch Asia Pacific Telecom, Media & Technology Conference          

2019 MPI is invited to attend Cathay Securities “Cathay Corporate Day” Investor Conference

 

 

MPI is invited to attend 2020 TPEx / KGI Taiwan Corporate Day

     MPI is invited to attend Bank of America Merrill Lynch,2020 Taiwan Tech Corporate Day Conference     

 

MPI is invited to attend Online Investor Conference held by Fubon Securities Co., Ltd.

MPI is invited to attend Online Investor Conference held by KGI Securities Co., Ltd.

2022 March MPI Corporation

 

     MPI is invited to attend 2020 TPEx / KGI Taiwan Corporate Day     

    MPI is invited to attend Sinopac Securities 2Q21
online Conference

Apr 2021 MPI Corporation

Sep 2021 MPI Corporation