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Enhanced Vertical Probe Card Solution 80 (EVS80™)

Laboratory Tested, Production Proven

MPI proudly introduces Enhanced Vertical Solution 80 (EVS80™) to the production probe card market. Where typical vertical probe card technologies have inconsistent contact resistance inherent with the floating needle structure, MPI’s EVS technology maintains the probe needle base in constant contact with the substrate structure. This technology also offers a significant improvement of longevity by decreasing the wear on the substrate’s Au pads.

MPI’s Constant Contact Technology

Beyond Stable Contact Resistance

MPI’s EVS80™ is not only designed to stabilize internal resistance variations, the unique patented buckling beam structure, with friction force control between needles and the alignment holes, eliminates the risk of binding. The EVS80™ also incorporates MPI’s special coating technique on the C4 pad configuration of the substrate. This advanced Au plating process also corrects for offsets between substrate and wafer thus providing accurate alignment during thermal testing.

EVS80 High Pin Count Probe Head

Overall Probe Card Performance

With capacity up to 35,000 probe pins, duration of 1.3 million touchdowns (TD), and path resistance standard deviation lower than 0.1 ohm,  MPI’s EVS80™ is the superior choice for those seeking a combination of reasonable cost of ownership and high quality wafer level production test.

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Sr. Field Service/Repair Engineer (2 openings)

Job Duties:
Responsible for repair of very high pin count (>30,000 pins) MEM's, vertical and cantilever probe cards (VPC and CPC). Replace PCB electrical components such as: Capacitors, resistors, special MUX IC. Adjust VPC space transformer flatness between MLO substrate and PCB by interposer connection. Evaluate customer feedback on probe card issue and take full card inspection to find the root cause. Provide technical support to customer’s new probe card verification on wafer sort and debug to identify setup issues, wafer product issues or program issues. Conduct training on new probe card and new technology application, including on-line clean and off-line maintenance. Contribute to probe card technical improvement to HQ production line. 30% domestic travel required (travel within US to customers’ sites for field service and repair support)

Job Requirements:
5 yrs. field service support and repair of high pin count (>30,000 pins) vertical probe card and cantilever probe card.

Send resume with Job # 202108  to



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