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MPI Cobra Probe Cards

Cobra Probe Card designed for mass production

MPI Cobra Probe Cards are a widely known fine pitch buckling beam probe card technology. Cobra buckling beam probe is applicable from early engineering pilot-runs to mass production on various wafer probing test applications. MPI’s technology includes both the most reliable performance and ease of use.

Cobra Probe Cards

MPI Cobra Probe Cards are a proven solution for a variety of semiconductor production tests including on wafer high volume manufacturing (HVM). Based on improved “Buckling Beam” technology – Cobra  , the cards are adapted for bond pad patterns such as full array,semi-array,peripheral and staggered – chip pattern. MPI’s technology has the world best overall cost-of-ownership (COO) for the following DUT packages :

Advanced Cobra Probe Card | Cobra Probe Card |Advanced Probe Card | Probe Cards

High Pin Count Cobra Probe Card



  • Eutectic Bump
  • Lead-free Bump
  • Copper Pillar (Cu Pillar)
  • Capped Pillar
  • Aluminum Pad

MPI VPC Solution can provide fine pitch probing for different DUT packages to meet high-density Flip chip specification.

APU Cobra Probe Card | Advanced Cobra Probe Card | Cobra Probe Card |Advanced Probe Card | Probe Card

APU Cobra Probe Card

MPI Cobra Probe Cards include high current carrying capability (CCC) and balanced contact force (BCF) . The technology is compatible with state-of-the-art space-transformer architectures. and is ready for applications requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, microprocessor, industrial microcontrollers, and more.

To achieve the semiconductor chip manufacture time-to-market (TTM) and Cost of Test (COT) demands, MPI’s highly skilled Cobra Probe Card team is collaborating throughout global project members for early engagement on custom designs including printed circuit board (PCB), space transformer (ST) and substrate (SB) design. 

Advanced Cobra Probe Card | Cobra Probe Card |Advanced Probe Card | Probe Card

Advanced Cobra Probe Card

Field Application Engineer

Job Location: San Jose, CA

Job Duties:

  • Assist in developing HW and SW measurement methodologies/solutions for analytical wafer probe solutions with signal applications from DC to millimeter wave frequencies as well as Silicon Photonics (SiPH);
  • Collaborate with customers on their measurement challenges, and provide applications specific product training;
  • Provide pre- and post-sale support to AST, customers, service department, and the sales channel developing HW and SW measurement solutions for analytical wafer probe stations;
  • Define application-specific solutions based on customer-provided device data and facilitate both customer and divisional teams to successful results;
  • Perform product training seminars for customer and sales channels as well as participate in trade shows and technical seminars;
  • Make recommendations regarding product improvement, new products, and quality enhancement;
  • Author, document, publish, and present measurement solutions via Seminars, Applications Notes, Briefs, and White Papers;
  • Prepare, plan, and assist with customer product demonstrations that highlight value-based differentiation of AST product offerings;
  • Develop unique and individual customer presentations designed to professionally position the MPI brand in the North American market and deliver formal presentations to customers.

Job Requirements:

Master’s degree in Electrical Eng., Electronics Eng., Physics, or Photonics; Must possess 6 months of relevant work experience; Travel to customers’ sites in US and headquarters in Taiwan is required.

Send resume to: MPI America, Inc., 2360 Qume Drive, Suite C, San Jose, CA 95131, Attn: Janet Chiang



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