Probe Cards | High Frequency Probing | Probe Card | Vertical Driver Probe Card | Probe Card | Logic Probe Card | Wafer Probe Card
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3DS is 3 dimensional spiral needle structure made by MEMS process, it’s especially suitable for high pin count(30k/card) , high current and high over-travel (force) devices. With preloading structure and rotatable tip, 3DS performs low and stable contact resistance either on Cu-pillar or Al probing. As well, such probe can produce smaller scrub marks in fine- pitch pad probing. 3DS takes lower risk on the probe head maintenance and needle replacement.
MPI Corporation develops and produces patented ST technologies for multi-site and thin package substrate applications. These products satisfy high speed loop-back and KGD (Known Good Die) testing specifications based on custom design requirements. These technologies offer a very attractive cost of ownership model and excellent lead-time when compared with alternative substrate ST technology.