3DS is 3 dimensional spiral needle structure made by MEMS process, it’s especially suitable for high pin count(30k/card), high current and high over-travel (force) devices. With preloading structure and rotatable tip, 3DS performs low and stable contact resistance either on Cu-pillar or Al probing. As well, such probe can produce smaller scrub marks in fine- pitch pad probing. 3DS takes lower risk on the probe head maintenance and needle replacement.
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