L-I-V Test

Laser Diode Test Systems

VCSEL LIV Test

L-I-V Test Systems

High-power Laser Diode Testing

Near Field Measurement

VCSEL Wafer Level Burn-in

Far Field Measurement

LIV Laser Diode Characterization 

Near Field Test

Far Field Test

Optical Measuring Systems

Optical Sensing
Optical Sensing
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Optical Sensing
Optical Sensing
Optical Sensing
Optical Sensing
Optical Sensing
Optical Sensing
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OPTICAL SENSING TEST SOLUTIONS

Vertical Cavity Surface Emitting Laser (VCSEL) based optical sensing technologies are finding their way into numerous consumer (Facial Recognition, Gesture Sensing, Augmented Reality) and automotive (LiDAR and In-Cabin Monitoring) applications. MPI’s comprehensive portfolio of test and measurement solutions are ready to meet the demands of the VCSEL based optical sensing market.

VCSEL Test Systems | Photonics Testers | VCSEL LIV Test | VCSEL Wafer Test | VCSEL Testing Equipment
MPI’s array of optical sensing solutions are well suited for the demands of both production and engineering environments. We are ready to meet customer’s critical testing and back-end processing needs:
  • Parametric Test and Measurement
  • Material Handling
  • Inspection
  • Wafer Level Reliability Test (WLBI)
MPI optical sensing solutions have been designed to meet the entire spectrum of VCSEL designs and configurations.
  • Front Emitting VCSEL
  • Rear Emitting VCSEL (Flip-Chip)
  • Wafer, Package, & Die Level

THE TECHNOLOGY

The Light-Current-Voltage (LIV) sweep test is a fundamental optical measurement used to determine the operating characteristics of devices such as laser diodes (LDs) and VCSELs.

MPI specializes in integrating a variety of Source and Measurement Units (SMU) providing accurate and synchronized power and voltage measurements in both pulsed (mS to nS) and CW modes.

  1. High speed nanosecond test instrumentation capability
  2. Electrical, Mechanical & Thermal system design to minimize the effects of self-heating, contact resistance and parasitics
  3. High speed optical measurements using integrating spheres for both low and high power VCSELs
Pulse Width at 10us

Pulse Width at 10µs

Pulse Width from 10us to 500us

Pulse Width from 10µs to 500µs

High Speed Pulsed Optical Measurements

  • Laser Diode Driver Integration for LiDAR / Time of Flight (TOF) applications
  • High fidelity current stimulus control enabled by MPI’s high frequency probe card technologies
  • Synchronized electrical/optical measurements and data capture
  • Interleaved current pulse generation for enhanced high throughput testing

Optical Spectrum Measurements

Spectral measurement & analysis over a broad range of temperatures.
Spectrum Measurement

Spectrum Measurement

-40~125 Degree Measurement Capability

-40°C ~ 125°C Measurement Capability

Laser Characterization

Laser Characterization

Laser Characterization

Laser Electrical / Optical performance  characterization
Far Field Measurements are used to characterize a VCSEL Array’s optical profile at longer working distances.

MPI specializes in:

  1. Optical system design and integration to achieve high quality Far Field images with working distances ranging from 4mm to 1.5m or more
  2.  Typical Far Field optical measurements include:
  • Divergence Angle
  • Eye Safety
  • Uniformity
  • Efficiency
3. Both Panel and Direct measurement methodologies are supported
VCSEL array (Far Field Measurement)

VCSEL Array (Far Field Measurement)

VCSEL Array with Lens Attached (Far Field Measurement)

VCSEL Array with Lens Attached (Far Field Measurement)

Far Field Measurement Options

Far Field measurement examples of  different device types

Eye Safety Measurement

Integrated analysis software for eye safety calculations
Laser Eye Safety Calculation

Laser Eye Safety Calculation

 

Direct Camera Far Field Measurement

Direct Camera Far Field
Measurement

Far Field Panel with Direct Camera

Far Field Light Collection Structure
(Panel with Direct Camera)

Far Field Optical Measurement

Two Far Field measurement options are available for specific optical device test requirements
Near Field measurements are used to characterize the optical power and beam characteristics in VCSEL arrays on a per emitter basis. 

MPI specializes in:

  1. Optical system design and integration to achieve high quality Near Field measurements for VCSELs with emitting apertures ranging from 5µm to 20µm
  2.  VCSEL array characterization (Uniformity, Detection of faulty emitters and pass/fail grading)
  3.  Optical Beam Characterization:
  • Numerical Aperture (NA)
  • Beam Diameter [D4σ (D4Sigma), D86]
  • Beam Quality (M2) using sequenced near field imaging
4. High speed optical measurements
Near Field Emitter Characterization

Near Field Emitter Characterization

Near Field Single Emitter

Near Field Single Emitter

VCSEL Near Field Emitter Characterization

VCSEL Array NF measurements on a per emitter basis for all standard parameters

VCSEL Array Parametric Distributions

Examples of VCSEL array intensity and beam diameter distributions
Near Field Intensity Measurement

Near Field Intensity Measurement

NF Beam Diameter (D4Sigma, D86)

Near Field Beam Diameter
(D4Sigma, D86)

ear Field M2 (M-Sqaured) Measurement

Near Field M2 (M-Squared) Measurement

Near Field M2 Measurement

Near Field M2 measurement using sequenced near field images
MPI’s portfolio of automated test and material handling solutions readily meet the diverse needs of the optical sensing manufacturing market. Whether it be thin wafer handling, device pick and place (PnP), extreme temperature testing or production data management, MPI has a solution that will streamline your production flow and enhance product yields.

MPI specializes in:

  1. Thin wafer handling solutions (Non-contact Bernoulli handler, Gel-Pak, and Carrier methods)
Extreme temperature testing:
  • Wafer Test: -60°C to ~200°C
  • Device Test: 0°C to 100°C
2. Production test automation and data management
  • Flexible recipe setting with multiple test sequence support
  • Multi-die test support
  • Configuration and test data management tools
Thin Wafer Handling - Gel-Pak

Thin Wafer Handling – Gel-pak

*Gel-Pak® is a Registered Trademark of Gel-Pak®, a Division of Delphon Industries.

Thin Wafer Handling-Non Contact Bernoulli Handler

Thin Wafer Handling –Non-contact Bernoulli Handler

Thin Wafer Handling- Carrier

Thin Wafer Handling – Carrier

Thin Wafer Handling Technology

Multiple thin wafer handling solutions available for different device types and manufacturing flows

 

Fully Automated Material Handling Capability

MPI has a complete line of die probers/sorters featuring highly reliable and precise pick and place mechanics suitable for a wide variety of high throughput applications
Die Pick and Place

Die Pick and Place

Package (EEL) Pick and Place

Package (EEL) Pick and Place

Thermal Chuck for Wafer Testing

Thermal Chuck for Wafer Testing

*Image Courtesy of ERS electronic GmbH

Thermal Chuck for Single Device Testing

Thermal Chuck for Single Device Testing

Thermal Control

Various thermal chuck options for Wafer/Die level testing
  • Wafer Testing: -60ºC ~200ºC
  • Single Device Testing: 0ºC to 100ºC
Multiple Recipes

Multiple Recipe Settings

 

Easy-to-use Software Suite

MPI’s powerful control software combines highly efficient operation with an intuitive and easy-to-use interface
  • Flexible recipe setup enables smooth and efficient operation per customer defined test plans
  • Multi-die probing capability boosting production throughput enabling lower cost of test

THE BENEFITS

Superior Optical Expertise and System Integration Capability for Customer’s
Requiring High Volume Manufacturing, Development and Test of Laser Diodes

High precision test and measurement results

High quality probing with optimizing automation

Proactive service and training support to keep  your equipment running with minimal interruptions

Controlling all aspects of mechanical/electrical device contact

Customer-centric customizable solutions for your specific requirements

EXPLORE MORE MPI PHOTONIC SOLUTIONS

MPI Photonic solutions for Optical Communication applications (Datacom, Telecom, Laser, Photodetector, Photodiode)

OPTICAL COMMUNICATIONS

Precision test and measurement solution for optical devices such as Photo Detectors and Laser Diodes

MPI Photonic solutions for Optical Sensing applications (VCSEL, LiDAR, ToF, Time-of-Flight, 3D Sensing, Facial Recognition, Automotive sensing)

SILICON PHOTONICS

Dedicated SiPH on-wafer tests designed to perform repeatable low noise measurements

MPI Photonic solutions for Micro Display applications (Micro LED, Mass Transfer, VR, AR)

MICRO DISPLAY

Accurate probing tool combined with idea mass transfer method

MPI Photonic solutions for LED applications (Automotive / General Lighting)

LED

Complete solution covers testing, sorting, and inspection from wafer to package die level

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