MPI Announced TITAN™ Multi-Contact Probe for RF IC Characterization

Taiwan, May 2nd, 2019 – MPI Corporation introduces the TITAN™ Multi-Contact Probe, the further advances of company’s TITAN™ RF probing technology for challenges of testing modern Si RF ICs.


TITAN™ Multi-Contact Probe allows customers to configure up to 15 probe channels for RF, bias and logic IC terminals featuring company’s proprietary MEMS contact tip with the one of a kind contact point visibility. It offers the unique combination of the contact width of 20 μm with the smallest probe pitch starting from 50 μm, and the longest lifespan of over 1 million touchdown cycles on Al pads.


TITAN™ Multi-Contact Probe was designed to reduce the cost of test of modern silicon highly-integrated RF ICs by probing on small pads and providing the longest lifespan, affordable price and short lead time”, says Andrej Rumiantsev, Director of RF Technologies of MPI Corporation’s Advanced Semiconductor Division. “Being the shortest probe of its kind, it enables over-temperature characterization of large ICs in shielded environment over a wide temperature range and, at the same time, it is the most convenient probe to use.”


The TITAN™ Multi-Contact Probe is another example of how MPI engineers help customers solve challenges of rapidly developing and highly-competitive RF IC market.


About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of divisional product technologies stimulates MPI product innovations that are meaningful to our precious customer base.

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Sr. Field Service/Repair Engineer (2 openings)

Job Duties:
Responsible for repair of very high pin count (>30,000 pins) MEM's, vertical and cantilever probe cards (VPC and CPC). Replace PCB electrical components such as: Capacitors, resistors, special MUX IC. Adjust VPC space transformer flatness between MLO substrate and PCB by interposer connection. Evaluate customer feedback on probe card issue and take full card inspection to find the root cause. Provide technical support to customer’s new probe card verification on wafer sort and debug to identify setup issues, wafer product issues or program issues. Conduct training on new probe card and new technology application, including on-line clean and off-line maintenance. Contribute to probe card technical improvement to HQ production line. 30% domestic travel required (travel within US to customers’ sites for field service and repair support)

Job Requirements:
5 yrs. field service support and repair of high pin count (>30,000 pins) vertical probe card and cantilever probe card.

Send resume with Job # 202108  to