MPI Introduces Unique NoiseShield™ Option for 1/f (Flicker) & RTN Measurements

Taiwan, Sept. 18th, 2019 – MPI introduced a new NoiseShield™ option, which provides excellent EMI-shielding, low impedance grounding and shortest possible cable lengths to reduce parasitic capacitance and to maximize the test system roll-off frequency. It reduces external magnetic field influences on the measurement results and makes the 1/f, RTN setup more robust and test lab location less-independent. It makes the probe station completely “invisible” and enables the measurement results down to the physical limit of the test instrumentation.

 

“The MPI NoiseShield™ is the next step in providing a high value solution for 1/f measurements.” Said Toe Naing Swe, Director Device Modeling, at MPI Advanced Semiconductor Test Division. “In combination with the MPI ShielDEnvironment™, users can now experience excellent EMI-Shielding for not only device under test (DUT) and the measurement instrument (such as pre-amplifier unit of ProPlus 9812DX), it also includes all cables and connectors. The fully integrated solution also shortens the cables by placing the LNA very close to DUT. Installed on TS3500-SE with MPI WaferWallet®, customers can now perform, for the first time ever, unsurpassed fully-automated 1/f measurements. MPI SENTIO® Software Suite includes native drivers for the ProPlus Design Solutions product suite, such as BSIMProPlus™ and NoiseProPlus™, making such automation out of the box easy.”

 

“The MPI prober is excellent and best I have ever worked with”, said Dr. Zhihong Liu, CEO and Co-Founder of ProPlus Design Solutions Inc. “For noise measurement, it gives the best performance both in shielding and reduction in parasitics. With it, we are able to reach the limit of our system without trade-offs. Using the High Precision LNA in 9812DX, we can get to the floor noise of 3e-27 A^2/Hz with >20KHz bandwidth and accurately monitor the bias current down to pA level simultaneously. It can also measure down to 0.1Hz in the low frequency end without the introduction of mechanical vibration. Using the MPI prober, we also measured a MOSFET with 10MHz on-wafer bandwidth and the noise level is reaching to our Wideband LNA noise floor.”

 

About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of divisional product technologies stimulates MPI product innovations that are meaningful to our precious customer base.

 

For more information please visit: www.mpi-corporation.com

 

About ProPlus Design Solutions

ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the leading provider of nano-scale SPICE modeling, the innovative giga-scale SPICE simulation and design for yield (DFY) applications, it provides the industry’s golden SPICE modeling platform, the first and only GigaSpice simulator, and the only integrated DFY design platform. Founded in 2006, ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China.

 

For more information, please visit: www.proplussolutions.com

Automotive Testing Expo 2019

Automotive Testing Expo 2019

  • Exhibition on October 22-24, 2019
  • The Suburban Collection Showplace, Novi, Michigan, USA
  • Please visit us at Booth No. 8034
  • Participating Division: Thermal
Qualcomm Builds 5G Ecosystem in Taiwan Enabling Taiwan Supply Chain Access to 5G Economic Benefits

Qualcomm Builds 5G Ecosystem in Taiwan Enabling Taiwan Supply Chain Access to 5G Economic Benefits

Roawen Chen, Qualcomm’s Senior Vice President of Manufacturing Technology and Operations.
(Image Source: Qualcomm)

 

The American enterprise Qualcomm held a groundbreaking ceremony for their new building on June 27th, 2019. The 5G technical laboratory officially launched its strategic planning in Taiwan to bolster the overall technical strength of Qualcomm in Taiwan. This effort will surely strengthen Qualcomm’s cooperation with Taiwan’s supply chain. It is expected that Qualcomm’s 5G business will experience rapid growth also benefiting the participating partners.

 

Chi-mai Chen, Vice Premier of the Executive Yuan, Yu-chin Hsu, Deputy Minister of the Ministry of Science and Technology, Chuan-neng Lin, Vice Minister of Ministry of Economic Affairs, and Mei-ying Huang, Chairperson of the Fair Trade Commission participated in the event. It is understood that Qualcomm spent a total of NT $5.5 billion to build the new structure, having an area of more than 7,270 square meters. Construction of the new building will be completed within two years, and is expected to be hold more than 1,000 employees.

 

In addition, Qualcomm’s Center for Operations, Manufacturing Engineering and Testing in Taiwan (COMET), the 5G Testing Laboratory, the Multimedia R&D Center, and the Mobile Artificial Intelligence Innovation Center will all be stationed in the new building. This is the first time that Qualcomm has constructed a new facility of this magnitude overseas without requiring rental space.

 

Roawen Chen, Senior Vice President of Manufacturing Technology and Operations of Qualcomm indicated that the construction of a new building in Taiwan’s Hsinchu Science Park means that the collaboration between Qualcomm and Taiwan’s ICT (information and communications technology) industry has marked a new milestone. S.T. Liew, Taiwan and South East Asia President of Qualcomm stated, “Qualcomm is devoted to working closely with Taiwanese industry in capturing global business opportunities. The company will continue to support the rapid development of Taiwan’s wireless communication and semiconductor ecosystem.” 

 

It is also the first time for Qualcomm to showcase its 5G laboratory in Taiwan, including 5G radio frequency (RF) IC testing, 5G module lab, biometric recognition sensing advance center and millimeter wave advance center. The equipment of these labs and centers was installed in the new building during 1H19. It is expected that more than 100 engineers will be recruited, and the scale of Qualcomm’s Taiwan 5G laboratory will continue to expand.

 

The Hsinchu Science Park’s supply chain includes IC design houses, wafer foundry and testing, etc. Once in full swing, Qualcomm’s 5G efforts is expected to increase the orders for Taiwanese vendors.   

 

As for the specific systems, besides purchasing test equipment from overseas vendors such as ADVANTEST, Qualcomm’s 5G Lab has also includes systems from MPI Corporation’s Advanced Semiconductor Test (AST) division. The lab is mainly for the testing of power amplifier (PA) chipsets with revenue benefits for all participants within Qualcomm’s 5G ecosystem.

 

Note: This press release is translated to English by MPI Corporation.

News Source: https://www.chinatimes.com/newspapers/20190628000234-260202?chdtv

Dive straight into the feedback!
Login below and you can start commenting using your own user instantly