Semiconductor Industry & Application
In semiconductor manufacturing, engineers design integrated circuits and IC devices. The process of manufacturing semiconductors (commonly called ICs, or chips) consists of more than a hundred steps. Temperature forcing systems and environmental test chambers are part of the final test process. These environmental test assure quality and help with failure analysis by environmental stressing the device throughout the semiconductor product design and manufacturing back end test.
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In the manufacturing of semiconductors electronic components for harsh environments, the IC package assembly and test stages of engineering and production include burn-in, electronic hot and cold testing at temperature, and other environmental test simulations. These semiconductor devices and electronics, once put in real world applications, can get exposed to extreme environmental conditions.
Environmental Stress Testing
Environmental stress conditions such as radiation exposure, temperature extremes, vibration, and dirt encountered by the military, on factory floors, and under the hoods of automobiles, these semiconductor devices need to keep working. To assure quality and reliability of electronic devices, semiconductor manufacturers need to simulate harsh environments during the engineering and production test stage. This is why the MPI Thermal TA-5000 Series ThermalAir temperature test products are part of the test.
- Product Engineering
- Back-End Test
- Incoming Inspection
- IC Handler Verification
- Functional Test
- Cooling the IC while Stress Full Cycle
- Failure Analysis
- Final Test
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Precision Temperature Forcing Systems use a direct temperature-controlled stream of hot or cold air to provide a precise thermal environment for temperature testing, conditioning and cycling of electronic and non-electronic assemblies and sub-systems. The ThermalAir Temperature system enables the test. This allows you to perform temperature simulation tests in situ, at a specific location, at your tester station, test bench or directly on the unit under test.
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