Corporation Event - MPI Corporation

The 29th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

  • Exhibition on May 29 – 31,  2017
  • Royton Sapporo, Hokkaido, Japan
  • Please visit us at Booth No. 16, in the Lobby on 3F
  • Participating Division: Advanced Semiconductor Test

R&S Taiwan & MPI Joint Workshop

  • May 24, 2017
  • Please come join the hands-on and workshop in R&S Taipei Training Center (台北市北投區北投路二段13號13樓)
  • Participating Division: Advanced Semiconductor Test

This workshop is being held in corporation with Rohde & Schwarz Taiwan. Register Now

[Subject:] Critical Success Factors for Wafer-Level Measurements at THz Frequencies
[Abstract:]With significant expansion of emerging THz applications, such as non-invasive spectroscopy, security and surveillance, the need for accurate, reliable and repeatable measurement data has become more crucial than ever. This is especially true for the research and technology development of the devices, integrated circuits and new product building blocks serving the need of THz applications.

This presentation will discuss unique solutions developed by MPI Corporation to address challenges of wafer-level calibration and measurements at THz frequencies, such as: integration of the measurement instrumentation, frequent system reconfiguration, impact of an operator on the accuracy and repeatability of data. Last but not least, the need for metrology-level analysis of the measured data and system calibration will be discussed as well.
[Presenter:]Hawk Liao
[Time:]13:30 - 14:30, Wednesday, May 24th, 2017


  • Exhibition on May 16-17, 2017
  • Hyatt Regency Indian Wells Resort & Spa (Indian Wells Ballroom)
  • Please visit us at Booth No.12
  • Participating Division: Probe Card Technologies
  • Exhibition on May 26, 2017
  • Intercontinental Shanghai Pudong
  • Please visit us at Booth No.5
  • Participating Division: Probe Card Technologies

Spring MOS-AK Workshop at DATE

  • March 31, 2017
  • Swisstech Convention Centre, Lausanne, Switzerland
  • Please come join the first afternoon workshop:
    “New Approach to Reduce Time-to-data when Characterizing Advanced Semiconductor Devices” by Dr. Andrej Rumiantsev
  • Participating Division: Advanced Semiconductor Test

30th IEEE International Conference on Microelectronic Test Structures (ICMTS)

  • Exhibition on March 28-30, 2017
  • Maison MINATEC, Grenoble, France
  • Please visit us in the room Titane
  • Participating Division: Advanced Semiconductor Test


Asia-Pacific Microwave Conference 2016

  • Exhibition on December 6-8, 2016
  • Hotel Pullman, Aerocity, New Delhi, India
  • Please visit us in Peacock Ballroom
  • Participating Division: Advanced Semiconductor Test

R&S 5G Innovation Summit 2016

  • November 29, 2016 in DoubleTree by Hilton San Diego – Del Mar, CA, USA
  • December 1, 2016 in Biltmore Hotel & Suites – Santa Clara, CA, USA
  • Please come join the joint-workshop
  • Participating Division: Advanced Semiconductor Test
An workshop is being held in corporation with Rohde & Schwarz USA. Register Now

European Microwave Week 2016


  • Exhibition: September 12 – 15, 2016; Workshop: September 12, 2016
  • Swisstech Convention Centre, Lausanne, Switzerland
  • Please visit our booth and join the workshop at Room 2A
  • Participating Division: Advance Semiconductor Test
R&S / MPI Workshop: Cutting-Edge Modeling and Measurement Techniques Addressing Challenges of 5G Circuits and Systems
This workshop is held in corporation with Rohde & Schwarz.

[Subject]:Wafer-Level Calibration and Measurements at mm-Wave Frequencies
[Abstract]:Accurate calibration of the entire wafer-level measurement system to the RF probe tip end or to the intrinsic device terminals is a critical success factor for extracting trustable device model parameters and characterizing true performance of a RF IC. This presentation will start with the basics of S-parameter measurement and calibration techniques at the wafer-level. Special attention will be paid to how to choose the right calibration method for specific measurement application needs. Finally, the potential sources of calibration residual errors will be analyzed. Practical examples will be given on how to minimize the impact of such errors on the measurement accuracy of a calibrated probe system.
[Presenter]:Dr. Andrej Rumiantsev
[Time]:10:40 – 11:30, Monday, September 12, 2016

SEMICON Taiwan 2016

  • Exhibition on September 07 – 09, 2016
  • Taipei Nangang Exhibition Center, Taipei, Taiwan
  • Please visit us at Booth No. 2522.
  • Participating Division: Thermal Test

High Frequency/Speed Layout Seminar

  • Exhibition: August 22, 2016 (12:50~16:00)
  • No.22, Jhonghua Rd., Hukou Township, Hsinchu County, Taiwan
  • Please visit us at Hsinchu Industrial Park Service Center , Convention Room
  • Participating Division: Probe Card Technologies

The 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

  • June 12-16, 2016
  • Žofín Palace, Prague, Czech Republic
  • Please visit us at Booth No. 21 on Level 2
  • Participating Division: Advanced Semiconductor Test

IEEE Semiconductor Wafer Test Workshop

  • June 5 – 8, 2016
  • Rancho Bernardo Inn, San Diego, CA, USA
  • Please visit us at Booth No. 2.
[Presentation]: A Customized Additional Advanced

Loopback technology on Vertical Probe Card

[Presenter]: Alex Wei
[Date]: Wednesday, June 08, 2016

ARFTG 87th Microwave Measurement Conference

IEEE MTT-S International Microwave Symposium 2016

The 25th Intl. Optoelectronics Exposition (Opto Taiwan 2016)

MPI cordially invites you to visit our booth at Opto Taiwan 2016 to be held from June 15-17, 2016 in Taipei, Taiwan.

You can have a better understanding of MPI products by meeting and discussing with our most experienced experts. We are more than happy to discuss solutions and offer MPI products combined with technical advancements that will surely help you maximize productivity and profitability.

If you have any questions or require further assistance, feel free to contact Ms. Lila Lee through email

We look forward to welcoming you at Opto Taiwan 2016 in Taipei.

Event Details:


  • Exhibition on May 10-11, 2016
  • Paradise Point Resort, San Diego, California
  • Please visit us at Booth No.5
  • Participating Division: Probe Card Technologies
  • Exhibition on May 18, 2016
  • Sheraton Hsinchu Hotel, Taiwan (3F,Ball room I )
  • Please visit us at Booth  No.5
  • Participating Division: Probe Card Technologies

SEMICON Southeast Asia 2016

Technical Presentation:

[Presentation]: Rolling Up Solutions of Wafer Probing Technologies.
[Presenter]: Joey Wu, Manager, Global Marketing
[Download]: Full Presentation Here

Rohde & Schwarz Technical Workshop in Moscow

  • April 12 -13, 2016
  • Rohde & Schwarz RUS OOO (Office Moscow)
  • Please come join the joint-workshop at Pavlovskaya street, b7, str.1, 5th floor Business Center Pavlovskiy

This workshop is being held in corporation with Rohde & Schwarz RUS OOO. → Register Now

[Subject:] Specifics of the wafer-level measurements and RF calibration based on planar transmission lines
[Abstract:]In this talk we will review specifics of the planar transmission lines such as dispersion and the frequency depended characteristic impedance. Detailed understanding of these phenomena is the key success factor for achieving accurate wafer-level calibration and measurement results. Special attention will be given to definition of the traveling waves, pseudo-waves in planar lines, pseudo S-parameters as well as to the calibration reference impedance of the wafer-level multiline Thru-Reflect-Line (TRL). The theoretical part will be supported by the CST-simulated data and by the measurement data obtained on an integrated RF Probe System.
[Presenter:]Dr. Andrej Rumiantsev
[Time:]15:30, Wednesday, April 13, 2016