Events Archives - Page 4 of 6 - MPI Corporation

SEMICON Southeast Asia 2016

Technical Presentation:

[Presentation]: Rolling Up Solutions of Wafer Probing Technologies.
[Presenter]: Joey Wu, Manager, Global Marketing
[Download]: Full Presentation Here
December 10th, 2015|Events, PCBU-News & Events|

Rohde & Schwarz Technical Workshop in Moscow

  • April 12 -13, 2016
  • Rohde & Schwarz RUS OOO (Office Moscow)
  • Please come join the joint-workshop at Pavlovskaya street, b7, str.1, 5th floor Business Center Pavlovskiy

This workshop is being held in corporation with Rohde & Schwarz RUS OOO. → Register Now

[Subject:] Specifics of the wafer-level measurements and RF calibration based on planar transmission lines
[Abstract:]In this talk we will review specifics of the planar transmission lines such as dispersion and the frequency depended characteristic impedance. Detailed understanding of these phenomena is the key success factor for achieving accurate wafer-level calibration and measurement results. Special attention will be given to definition of the traveling waves, pseudo-waves in planar lines, pseudo S-parameters as well as to the calibration reference impedance of the wafer-level multiline Thru-Reflect-Line (TRL). The theoretical part will be supported by the CST-simulated data and by the measurement data obtained on an integrated RF Probe System.
[Presenter:]Dr. Andrej Rumiantsev
[Time:]15:30, Wednesday, April 13, 2016
December 10th, 2015|Events|

29th IEEE International Conference on Microelectronic Test Structures (ICMTS)

  • March 28 – 31, 2016
  • Hotel Mielparque Yokohama, Kanagawa, Japan
  • Please visit us in Hall Etoile/Cherie, 2F
  • Participating Division: Advanced Semiconductor Test
December 10th, 2015|Events|

ElectronTechExpo 2016

  • March 15 – 17, 2016
  • Crocus Expo, Moscow, Russia
  • Please visit us at Booth No. A423, Pavilion 2
  • Participating Division: Advanced Semiconductor Test
December 10th, 2015|Events|


MPI Semicon China 2016
December 10th, 2015|Events, PCBU-News & Events|

Asia-Pacific Microwave Conference 2015

  • Exhibition on December 7 – 9, 2015
  • Jinling Hotel Nanjing, Nanjing, China (南京金陵飯店新大樓)
  • Please visit us at Booth No. 315, Kunlun Ballroom, 2F (崑崙)
October 27th, 2015|Events|

ARFTG 86th Microwave Measurement Conference

  • December 1 – 4, 2015
  • Georgia Tech Hotel and Conference Center, Atlanta, Georgia
  • Please come join the short course in Room Conference B
Invited ARFTG / NIST Short Course
[Subject:] On Wafer S-Parameters & Uncertainties
[Abstract:]Wafer-level S-parameter measurement at mm-wave and sub-mm wave frequencies plays a crucial role in the model development and IC design verification and debug of advanced semiconductor technologies. Accurate calibration of the entire wafer-level measurement system to the RF probe tip end or to the intrinsic device terminals is a critical success factor for extracting trustable device model parameters and characterizing true performance of a RF IC. This presentation will start with the basics of S-parameter measurement and calibration techniques at wafer-level. Special attention will be paid to how to choose the right calibration method for specific measurement application needs. Definition of the calibration reference plane and the measurement reference impedance of a calibrated system will be reviewed as well. Finally, the potential sources of calibration residual errors will be analyzed. Practical examples will be given on how to minimize the impact of such errors on the measurement accuracy of a calibrated probe system.
[Presenter:]Dr. Andrej Rumiantsev
[Time:]13:50 – 14:40, Tuesday, December 1st, 2015
October 27th, 2015|Events|

R&S Technology Week 2015 in Taiwan (Kaohsiung Session)

  • November 27, 2015
  • Grand Hi-Lai Hotel, Kaohsiung, Taiwan (高雄漢來飯店)
  • Please come join thejoint-workshop in Room Golden Phoenix, 9F (金鳳廳)

This workshop is being held in corporation with Rohde & Schwarz Taiwan.→Register Now

[Subject:] Relentless Innovations for un-compromising measurement accuracy of sub-mm wave IC's at the wafer-level
[Abstract:]Challenges when obtaining accurate, reliable and repeatable measurement results of sub-mm wave ICs at the wafer-level drastically increases with the frequency. Complexity of the measurement setup and its calibration, the need for data obtained for multiple frequency bands and unacceptably high signal loss in transmission media push for relentless innovations.
In this presentation, we will discuss new approaches of integration a sub-millimetre wave VNA with the probe system into a complete measurement solution. The unique design of the probe system enabled highest possible measurement dynamic range without compromising on mechanical stability, as well as simple and fastest system reconfiguration for different frequency bands. Special attention will be given to the system calibration and solutions for eliminating complexity of the calibration task, reducing mistakes and minimising calibration residual errors.
[Presenter:]Dr. Andrej Rumiantsev (Co-Presenter: Cyrus Chiu)
[Time:]13:20 - 14:20, Friday, November 27th, 2015
October 27th, 2015|Events|

Productronica 2015

August 13th, 2015|Events|

5th International Workshop on Epitaxial Growth and Fundamental Properties of Semiconductor Nanostructures (SemiconNano)

  • Exhibition on September 9 – 10, 2015
  • Lakeshore Hotel, Hsinchu City, Taiwan
August 11th, 2015|Events|