Events Archives - Page 3 of 7 - MPI Corporation

30th IEEE International Conference on Microelectronic Test Structures (ICMTS)

  • Exhibition on March 28-30, 2017
  • Maison MINATEC, Grenoble, France
  • Please visit us in the room Titane
  • Participating Division: Advanced Semiconductor Test
February 6th, 2017|Events|

SEMICON CHINA 2017

February 6th, 2017|Events, PCBU-News & Events|

Asia-Pacific Microwave Conference 2016

  • Exhibition on December 6-8, 2016
  • Hotel Pullman, Aerocity, New Delhi, India
  • Please visit us in Peacock Ballroom
  • Participating Division: Advanced Semiconductor Test
November 10th, 2016|Events|

R&S 5G Innovation Summit 2016

  • November 29, 2016 in DoubleTree by Hilton San Diego – Del Mar, CA, USA
  • December 1, 2016 in Biltmore Hotel & Suites – Santa Clara, CA, USA
  • Please come join the joint-workshop
  • Participating Division: Advanced Semiconductor Test
An workshop is being held in corporation with Rohde & Schwarz USA. Register Now
November 10th, 2016|Events|

European Microwave Week 2016

September 2nd, 2016|Events|

ESSCIRC – ESSDERC 2016

  • Exhibition: September 12 – 15, 2016; Workshop: September 12, 2016
  • Swisstech Convention Centre, Lausanne, Switzerland
  • Please visit our booth and join the workshop at Room 2A
  • Participating Division: Advance Semiconductor Test
R&S / MPI Workshop: Cutting-Edge Modeling and Measurement Techniques Addressing Challenges of 5G Circuits and Systems
This workshop is held in corporation with Rohde & Schwarz.

[Subject]:Wafer-Level Calibration and Measurements at mm-Wave Frequencies
[Abstract]:Accurate calibration of the entire wafer-level measurement system to the RF probe tip end or to the intrinsic device terminals is a critical success factor for extracting trustable device model parameters and characterizing true performance of a RF IC. This presentation will start with the basics of S-parameter measurement and calibration techniques at the wafer-level. Special attention will be paid to how to choose the right calibration method for specific measurement application needs. Finally, the potential sources of calibration residual errors will be analyzed. Practical examples will be given on how to minimize the impact of such errors on the measurement accuracy of a calibrated probe system.
[Presenter]:Dr. Andrej Rumiantsev
[Time]:10:40 – 11:30, Monday, September 12, 2016
September 2nd, 2016|Events|

SEMICON Taiwan 2016

  • Exhibition on September 07 – 09, 2016
  • Taipei Nangang Exhibition Center, Taipei, Taiwan
  • Please visit us at Booth No. 2522.
  • Participating Division: Thermal Test
September 2nd, 2016|Events|

High Frequency/Speed Layout Seminar

  • Exhibition: August 22, 2016 (12:50~16:00)
  • No.22, Jhonghua Rd., Hukou Township, Hsinchu County, Taiwan
  • Please visit us at Hsinchu Industrial Park Service Center , Convention Room
  • Participating Division: Probe Card Technologies
August 22nd, 2016|Events, PCBU-News & Events|

The 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

  • June 12-16, 2016
  • Žofín Palace, Prague, Czech Republic
  • Please visit us at Booth No. 21 on Level 2
  • Participating Division: Advanced Semiconductor Test
June 17th, 2016|Events|

IEEE Semiconductor Wafer Test Workshop

  • June 5 – 8, 2016
  • Rancho Bernardo Inn, San Diego, CA, USA
  • Please visit us at Booth No. 2.
[Presentation]: A Customized Additional Advanced

Loopback technology on Vertical Probe Card

[Presenter]: Alex Wei
[Date]: Wednesday, June 08, 2016
May 4th, 2016|Events, PCBU-News & Events|