Anderson Wu, Author at MPI Corporation

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So far Anderson Wu has created 74 blog entries.

31th IEEE International Conference on Microelectronic Test Structures (ICMTS)

  • Exhibition on March 20-22, 2018
  • Courtyard Marriott Austin Convention Center, Austin, TX, USA
  • Please visit us in the room Brazos
  • Participating Division: Advanced Semiconductor Test
February 23rd, 2018|Events|

SEMICON CHINA 2018

February 23rd, 2018|Events, PCBU-News & Events|

MPI at Productronica with Semicon Europa 2017 – Event Highlights

Munich, Germany, Nov. 17th, 2017 – MPI Corporation, the global technology leader in test and measurement markets for various applications, attended this year’s Semicon Europa. Strategically staged alongside Productronica, this year’s Semicon Europa has become the largest and most advanced Microelectronics event in Europe.

IMG_8389“Semicon Europa is the largest platform for exchanging the latest ideas on semiconductor manufacturing in Europe and has drawn tens of thousands of attendances worldwide. MPI’s presence at the show enabled precision engagement with the market on the latest product innovations.” Says Meiling Wu, Corporate Marcom, MPI Corporation. “Products were very well received during the event proving the MPI now has the world’s leading and most economically viable solutions. This high degree of success would not have been possible without the excellent partnership and support from both HTT Group (www.httgroup.eu) and ATV Systems (www.atv-systems.de). Working together with both of these World Class organizations, it is easy to see a long and prosperous future.”

At Semicon Europa, MPI demonstrated its technological IMG_7229strength by sharing first-hand product developments, including the advanced cantilever/vertical probe card technologies, unparalleled characterization and modeling offerings, ultra-low noise probe systems, ThermalAir stream systems, LED, Micro LED, Optical and Communications wafer probers perfectly suited for many engineering and production applications.
About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross- pollination of product technologies allows each new innovation to provide differentiation in areas that are meaningful to our precious customer base.

For more information please visit: mpi-corporation.com

Press Contact:

Lila Lee
Marketing Communications
Photonics Automation Division
MPI Corporation
Lila.lee@mpi.com.tw

December 28th, 2017|Events, PA-News|

ProPlus and MPI Corporation Establish Strategic Partnership, Announce Availability of a Characterization and Modeling Solution

Cross-Licensing Agreement Brings Next-Level Wafer-Level Noise Characterization,
Enabling High Throughput Measurements with Advanced Probing Technologies 

Taiwan, Dec. 12th, 2017 – ProPlus Design Solutions Inc. and MPI Corporation today announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus’ SPICE modeling and noise characterization solution with MPI’s advanced probing technologies. The integrated solution offers seamless support of the MPI probe stations to perform automated measurement of DC, CV and noise characteristics, enabling MPI users easy access to the most accurate ProPlus SPICE modeling and noise characterization offerings. The advanced probing technologies developed by MPI are optimized for the latest ProPlus 9812DX noise analyzer with improved grounding and shielding technologies critical to wafer-level noise characterization.

Under the partnership agreement, ProPlus users are able to integrate MPI’s advanced semi-automatic probe stations in their characterization and modeling flow for better noise measurement quality. The close collaboration also proved that probe card wafer-level noise characterization is possible using the 9812DX noise analyzer. Previously, these measurements were performed using manipulators and easily introducing RF interferences and oscillations. The advanced probe card technology specially developed for noise measurement provides better data quality and stability, as well as improves flexibility of wafer-level noise characterization for higher throughput.

“ProPlus Design Solutions continues to invest on improving the technologies that made wafer-level noise characterization possible 20 years ago,” remarks Dr. Zhihong Liu, chairman and chief executive officer of ProPlus Design Solutions. “We brought it to the next level with a specially designed probe card for a tightly integrated noise system thus delivering the fastest and most accurate noise characterization of the highest quality. We’re pleased to work with MPI on this effort.”

“The collaboration with ProPlus Design Solutions has enabled a seamlessly integrated wafer level low-frequency noise measurement capability with guaranteed system configuration and performance,” says Dr. Stojan Kanev, general manager of Advanced Semiconductor Test Division at MPI Corporation. “We now offer the most advanced high throughput noise characterization and modeling system. MPI’s exceptional shielding technology provides world class 1/f noise measurement capability. Customers may now rest assured these systems are validated to provide reliable and accurate noise measurement capability while enjoying a reduced cost of test.”

Availability and Pricing
The integrated solution has been adopted by leading semiconductor companies. ProPlus and MPI Corporation will demonstrate the joint solution globally throughout 2018. Interested users can request a demo at either ProPlus lab in San Jose, Calif., or the MPI lab in Taiwan. Pricing is available upon request.

About MPI Corporation
Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of product technologies allows each new innovation to provide differentiation in areas that are meaningful to our precious customer base.

For more information please visit: mpi-corporation.com

About ProPlus Design Solutions
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the leading provider of nano-scale SPICE modeling, the innovative giga-scale SPICE simulation and design for yield (DFY) applications, it provides the industry’s golden SPICE modeling platform, the first and only GigaSpice simulator, and the only integrated DFY design platform. Founded in 2006, ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China.

For more information, contact:
Nanette Collins
Public Relations for ProPlus Design Solutions
(617) 437-1822
nanette@nvc.com

December 12th, 2017|AST-NEWS|

OFC 2018

December 6th, 2017|Events, PA-News|

MPI Corporation Introduces New 300 mm PRIME™ Thermal Chuck Technology

Taiwan, Nov. 14th, 2017 – MPI Corporation has introduced a new 300 mm thermal chuck designated PRIME™ technology for wafer probe stations with full temperature range thermal testing while delivering unsurpassed performance and flexibility.

Continuing the innovative leadership within the engineering probe system market, MPI Corporation has co-developed with ERS Electronic GmbH, the leader of wafer thermal solutions, a new 300 mm thermal PRIME™ technology. Capability enhancements include the fastest transition time in the industry, unmatched electrical performance, higher application flexibility, wider thermal range and easy field upgradability. Incorporated with the Dynamic Thermal Shield (DTS) from ERS, soak times are shortened by a factor of 60%. Within the complete test cycle of -60°C to +300°C, the PRIME™ technology chucks are ready for the test. Furthermore, the DTS continuous dew point controlled environment reduces tedious maintenance requirements.

The PRIME™ technology platform not only enhances performance, but includes a multi-application modular design concept for the ultimate in flexibility. Options include a dedicated top surface for RF & mmW, singular IC probing, inert-gas atmospheric testing for Wafer Level Reliability, High Power  with 3 kV isolation,

30 µT residual ferromagnetism, and ultra-low-noise down to fA range with more application specific configurations to be released in the coming months. In parallel, the 300 mm (12”) wafer probe station can be configured  with temperature starting points of  -60°C,  -40°C, -10°C,  +20°C  or  +30°C  and at end points  of +200°C or +300°C. All of this is easily configurable to specific test requirements and budgets.

“Unsurpassed flexibility in temperature range for applications from RF, mmW, ultra-low noise, 1/f, to high power applications and combine with unique field upgrade paths, the PRIME™ technology is the most advanced thermal chuck systems on the market today. PRIME™ technology enables the users to become more effective and efficient in thermal wafer probing applications.” Says Stojan Kanev, General Manager of MPI Corporation’s Advanced Semiconductor Division. “Adjusting to the current budgets, reducing cost of test, footprint size, significant CDA consumption and soak times for the entire system is the power behind the latest customer oriented solution.”

“We have managed to leverage the core competencies of both companies, and the result is our PRIME™ technology. We believe that PRIME™ will meet the demand of the fast-growing market for high voltage and high-frequency chips” says Klemens Reitinger, CEO of ERS electronic GmbH. “Our partnership with MPI has been extremely valuable in terms of gaining better understanding of the analytical probing market and its customers’ challenges. Being able to identify the future needs of growth markets such as the IoT, electro mobility and sensors is essential to ERS, and we believe that our new PRIME™ chucks will enhance challenging IC characterization and overall enable faster development time.”

About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of product technologies allows each new innovation to provide differentiation in areas that are meaningful to our precious customer base.

For more information please visit: mpi-corporation.com

November 14th, 2017|AST-NEWS|

R&S Technology Week 2017 in Taiwan (Hsinchu Session)

  • November 16, 2017
  • Ambassador Hotel Hsinchu, Taiwan (新竹國賓飯店)
  • Please visit our booth on 10F
  • Participating Division: Advanced Semiconductor Test

This event is held by Rohde & Schwarz Taiwan. → Register Now

October 27th, 2017|Events|

SEMICON Europa 2017

October 27th, 2017|Events, PCBU-News & Events|

Asia-Pacific Microwave Conference 2017

  • November 13-16, 2017
  • Renaissance Kuala Lumpur Hotel, Malaysia
  • Please visit us at Booth 1B/5B
  • Participating Division: Advanced Semiconductor Test
October 27th, 2017|Events|

TPCA Show 2017

  • Exhibition on October 25-27, 2017
  • Taipei Nangang Exhibition Center, Taipei, Taiwan
  • Please visit us at Booth No. J331
  • Participating Division: Probe Card Technologies
October 19th, 2017|Events, PCBU-News & Events|